11.4 Thermal Considerations

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the powerdissipation limits of a given component.

Two basic approaches for enhancing thermal performance are listed below:

• Improving the power dissipation capability of the PCB design
• Introducing airflow in the system

For more details on how to use the thermal parameters, see the application notes: Thermal Characteristics (SZZA017), and Semiconductor and IC Package Thermal Metrics (SPRA953)