米6体育平台手机版

ZHCSBD3D July 2013 – August 2019 TPS63050 , TPS63051

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		TPS6305x		UNIT
		WCSP	RMW
		12 PINS	12 PINS
R_θJA	Junction-to-ambient thermal resistance	89.9	37.3	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	0.7	30.4	°C/W
R_θJB	Junction-to-board thermal resistance	43.9	8.0	°C/W
ψ_JT	Junction-to-top characterization parameter	2.9	0.4	°C/W
ψ_JB	Junction-to-board characterization parameter	43.7	7.8	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	2.5	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.