ZHCSP59B October   2021  – June 2022 TPS631000

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Rating
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics 
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Enable and Soft Start
      3. 7.3.3 Adjustable Output Voltage
      4. 7.3.4 Mode Selection (PFM/FPWM)
      5. 7.3.5 Reverse Current Operation
      6. 7.3.6 Protection Features
        1. 7.3.6.1 Input Overvoltage Protection
        2. 7.3.6.2 Output Overvoltage Protection
        3. 7.3.6.3 Short Circuit Protection
        4. 7.3.6.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design with WEBENCH Tools
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Setting the Output Voltage
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design with WEBENCH Tools
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.1 Layout Guidelines

The PCB layout is an important step to maintain the high performance of the TPS631000 device.

  • Place input and output capacitors as close as possible to the IC. Traces need to be kept short. Route wide and direct traces to the input and output capacitors results in low trace resistance and low parasitic inductance.
  • The sense trace connected to FB is signal trace. Keep these traces away from LX1 and LX2 nodes.
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