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ZHCSIG5E July 2018 – August 2021 TPS63805 , TPS63806 , TPS63807

PRODUCTION DATA

8.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)

THERMAL METRIC⁽¹⁾		TPS6380x	UNIT
		3x5 Ball WCSP
		15 PINS
R_ΘJA	Junction-to-ambient thermal resistance	78.8	°C/W
R_ΘJC(top)	Junction-to-case (top) thermal resistance	0.6	°C/W
R_ΘJB	Junction-to-board thermal resistance	19.5	°C/W
Ψ_JT	Junction-to-top characterization parameter	0.3	°C/W
Ψ_JB	Junction-to-board characterization parameter	19.5	°C/W
R_ΘJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.