ZHCSL70D March   2020  – October 2020 TPS63900

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Trapezoidal Current Control
      2. 7.3.2 Device Enable / Disable
      3. 7.3.3 Soft Start
      4. 7.3.4 Input Current Limit
      5. 7.3.5 Dynamic Voltage Scaling
      6. 7.3.6 Device Configuration (Resistor-to-Digital Interface)
      7. 7.3.7 SEL Pin
      8. 7.3.8 Short-Circuit Protection
        1. 7.3.8.1 Current Limit Setting = 'Unlimited'
        2. 7.3.8.2 Current Limit Setting = 1 mA to 100 mA
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design with WEBENCH Tools
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Setting The Output Voltage
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TPS63900 UNIT
DSK Package (WSON)
10 PINS
RθJA Junction-to-ambient thermal resistance 64.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 62.3 °C/W
RθJB Junction-to-board thermal resistance 31.1 °C/W
ψJT Junction-to-top characterization parameter 1.6 °C/W
ψJB Junction-to-board characterization parameter 31.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 10.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
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