ZHCSIH9F March   2009  – July 2018 TPS65023-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Step-Down Converters, VDCDC1, VDCDC2, and VDCDC3
      2. 8.3.2 Soft Start
      3. 8.3.3 Active Discharge When Disabled
      4. 8.3.4 Power-Good Monitoring
      5. 8.3.5 Low-Dropout Voltage Regulators
      6. 8.3.6 Undervoltage Lockout
    4. 8.4 Device Functional Modes
      1. 8.4.1 VRTC Output and Operation With or Without Backup Battery
      2. 8.4.2 Power-Save Mode Operation (PSM)
      3. 8.4.3 Low-Ripple Mode
      4. 8.4.4 100% Duty-Cycle Low-Dropout Operation
      5. 8.4.5 System Reset and Control Signals
        1. 8.4.5.1 DEFLDO1 and DEFLDO2
        2. 8.4.5.2 Interrupt Management and the INT Pin
    5. 8.5 Programming
      1. 8.5.1 Power-Up Sequencing
      2. 8.5.2 Serial Interface
    6. 8.6 Register Maps
      1. 8.6.1 VERSION Register (address: 00h) Read-Only
      2. 8.6.2 PGOODZ Register (address: 01h) Read-Only
        1. Table 5. PGOODZ Register Field Descriptions
      3. 8.6.3 MASK Register (address: 02h)
      4. 8.6.4 REG_CTRL Register (address: 03h)
        1. Table 6. REG_CTRL Register Field Descriptions
      5. 8.6.5 CON_CTRL Register (address: 04h)
        1. Table 7. CON_CTRL Register Field Descriptions
      6. 8.6.6 CON_CTRL2 Register (address: 05h)
        1. Table 8. CON_CTRL2 Register Field Descriptions
      7. 8.6.7 DEFCORE Register (address: 06h)
        1. Table 9. DEFCORE Register Field Descriptions
      8. 8.6.8 DEFSLEW Register (address: 07h)
        1. Table 10. DEFSLEW Register Field Descriptions
      9. 8.6.9 LDO_CTRL Register (address: 08h)
        1. Table 11. LDO_CTRL Register Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Reset Condition of DCDC1
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection for the DC-DC Converters
        2. 9.2.2.2 Output Capacitor Selection
        3. 9.2.2.3 Input Capacitor Selection
        4. 9.2.2.4 Output Voltage Selection
        5. 9.2.2.5 VRTC Output
        6. 9.2.2.6 LDO1 and LDO2
        7. 9.2.2.7 TRESPWRON
        8. 9.2.2.8 VCC Filter
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 接收文档更新通知
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) TPS65023-Q1 UNIT
RHA (VQFN) RSB (WQFN)
40 PINS 40 PINS
RθJA Junction-to-ambient thermal resistance 31.6 34.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 18.2 14.7 °C/W
RθJB Junction-to-board thermal resistance 6.6 6.6 °C/W
ψJT Junction-to-top characterization parameter 0.2 0.2 °C/W
ψJB Junction-to-board characterization parameter 6.5 6.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.7 1.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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