ZHCSG44F June   2017  – October 2024 TPS650864

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Total Current Consumption
    6. 6.6  Electrical Characteristics: Reference and Monitoring System
    7. 6.7  Electrical Characteristics: Buck Controllers
    8. 6.8  Electrical Characteristics: Synchronous Buck Converters
    9. 6.9  Electrical Characteristics: LDOs
    10. 6.10 Electrical Characteristics: Load Switches
    11. 6.11 Digital Signals: I2C Interface
    12. 6.12 Digital Input Signals (CTLx)
    13. 6.13 Digital Output Signals (IRQB, GPOx)
    14. 6.14 Timing Requirements
    15. 6.15 Switching Characteristics
    16. 6.16 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1  Overview
    2. 7.2  Functional Block Diagram
    3. 7.3  TPS6508640 Design and Settings
      1. 7.3.1 TPS6508640 OTP Summary
    4. 7.4  TPS65086401 Design and Settings
      1. 7.4.1 TPS65086401 OTP Summary
      2.      31
    5. 7.5  TPS6508641 Design and Settings
      1. 7.5.1 TPS6508641 OTP Summary
    6. 7.6  TPS65086470 Design and Settings
      1. 7.6.1 TPS65086470 OTP Summary
    7. 7.7  SMPS Voltage Regulators
      1. 7.7.1 Controller Overview
      2. 7.7.2 Converter Overview
      3. 7.7.3 DVS
      4. 7.7.4 Decay
      5. 7.7.5 Current Limit
    8. 7.8  LDOs and Load Switches
      1. 7.8.1 VTT LDO
      2. 7.8.2 LDOA1–LDOA3
      3. 7.8.3 Load Switches
    9. 7.9  Power Goods (PGOOD or PG) and GPOs
    10. 7.10 Power Sequencing and VR Control
      1. 7.10.1 CTLx Sequencing
      2. 7.10.2 PG Sequencing
      3. 7.10.3 Enable Delay
      4. 7.10.4 Power-Up Sequence
      5. 7.10.5 Power-Down Sequence
      6. 7.10.6 Sleep State Entry and Exit
      7. 7.10.7 Emergency Shutdown
    11. 7.11 Device Functional Modes
      1. 7.11.1 Off Mode
      2. 7.11.2 Standby Mode
      3. 7.11.3 Active Mode
    12. 7.12 I2C Interface
      1. 7.12.1 F/S-Mode Protocol
    13. 7.13 Register Maps
      1. 7.13.1  Register Map Summary
      2. 7.13.2  DEVICEID1: 1st PMIC Device and Revision ID Register (offset = 00h) [reset = X]
      3. 7.13.3  DEVICEID2: 2nd PMIC Device and Revision ID Register (offset = 01h) [reset = X]
      4. 7.13.4  IRQ: PMIC Interrupt Register (offset = 02h) [reset = 0000 0000]
      5. 7.13.5  IRQ_MASK: PMIC Interrupt Mask Register (offset = 03h) [reset = 1111 1111]
      6. 7.13.6  PMICSTAT: PMIC Status Register (offset = 04h) [reset = 0000 0000]
      7. 7.13.7  SHUTDNSRC: PMIC Shut-Down Event Register (offset = 05h) [reset = 0000 0000]
      8. 7.13.8  BUCK1CTRL: BUCK1 Control Register (offset = 20h) [reset = X]
      9. 7.13.9  BUCK2CTRL: BUCK2 Control Register (offset = 21h) [reset = X]
      10. 7.13.10 BUCK3DECAY: BUCK3 Decay Control Register (offset = 22h) [reset = X]
      11. 7.13.11 BUCK3VID: BUCK3 VID Register (offset = 23h) [reset = X]
      12. 7.13.12 BUCK3SLPCTRL: BUCK3 Sleep Control VID Register (offset = 24h) [reset = X]
      13. 7.13.13 BUCK4CTRL: BUCK4 Control Register (offset = 25h) [reset = X]
      14. 7.13.14 BUCK5CTRL: BUCK5 Control Register (offset = 26h) [reset = X]
      15. 7.13.15 BUCK6CTRL: BUCK6 Control Register (offset = 27h) [reset = X]
      16. 7.13.16 LDOA2CTRL: LDOA2 Control Register (offset = 28h) [reset = X]
      17. 7.13.17 LDOA3CTRL: LDOA3 Control Register (offset = 29h) [reset = X]
      18. 7.13.18 DISCHCTRL1: 1st Discharge Control Register (offset = 40h) [reset = X]
      19. 7.13.19 DISCHCTRL2: 2nd Discharge Control Register (offset = 41h) [reset = X]
      20. 7.13.20 DISCHCTRL3: 3rd Discharge Control Register (offset = 42h) [reset = X]
      21. 7.13.21 PG_DELAY1: 1st Power Good Delay Register (offset = 43h) [reset = X]
      22. 7.13.22 FORCESHUTDN: Force Emergency Shutdown Control Register (offset = 91h) [reset = 0000 0000]
      23. 7.13.23 BUCK1SLPCTRL: BUCK1 Sleep Control Register (offset = 92h) [reset = X]
      24. 7.13.24 BUCK2SLPCTRL: BUCK2 Sleep Control Register (offset = 93h) [reset = X]
      25. 7.13.25 BUCK4VID: BUCK4 VID Register (offset = 94h) [reset = X]
      26. 7.13.26 BUCK4SLPVID: BUCK4 Sleep VID Register (offset = 95h) [reset = X]
      27. 7.13.27 BUCK5VID: BUCK5 VID Register (offset = 96h) [reset = X]
      28. 7.13.28 BUCK5SLPVID: BUCK5 Sleep VID Register (offset = 97h) [reset = X]
      29. 7.13.29 BUCK6VID: BUCK6 VID Register (offset = 98h) [reset = X]
      30. 7.13.30 BUCK6SLPVID: BUCK6 Sleep VID Register (offset = 99h) [reset = X]
      31. 7.13.31 LDOA2VID: LDOA2 VID Register (offset = 9Ah) [reset = X]
      32. 7.13.32 LDOA3VID: LDOA3 VID Register (offset = 9Bh) [reset = X]
      33. 7.13.33 BUCK123CTRL: BUCK1-3 Control Register (offset = 9Ch) [reset = X]
      34. 7.13.34 PG_DELAY2: 2nd Power Good Delay Register (offset = 9Dh) [reset = X]
      35. 7.13.35 SWVTT_DIS: SWVTT Disable Register (offset = 9Fh) [reset = X]
      36. 7.13.36 I2C_RAIL_EN1: 1st VR Pin Enable Override Register (offset = A0h) [reset = X]
      37. 7.13.37 I2C_RAIL_EN2/GPOCTRL: 2nd VR Pin Enable Override and GPO Control Register (offset = A1h) [reset = X]
      38. 7.13.38 PWR_FAULT_MASK1: 1st VR Power Fault Mask Register (offset = A2h) [reset = X]
      39. 7.13.39 PWR_FAULT_MASK2: 2nd VR Power Fault Mask Register (offset = A3h) [reset = X]
      40. 7.13.40 GPO1PG_CTRL1: 1st GPO1 PG Control Register (offset = A4h) [reset = X]
      41. 7.13.41 GPO1PG_CTRL2: 2nd GPO1 PG Control Register (offset = A5h) [reset = X]
      42. 7.13.42 GPO4PG_CTRL1: 1st GPO4 PG Control Register (offset = A6h) [reset = X]
      43. 7.13.43 GPO4PG_CTRL2: 2nd GPO4 PG Control Register (offset = A7h) [reset = X]
      44. 7.13.44 GPO2PG_CTRL1: 1st GPO2 PG Control Register (offset = A8h) [reset = X]
      45. 7.13.45 GPO2PG_CTRL2: 2nd GPO2 PG Control Register (offset = A9h) [reset = X]
      46. 7.13.46 GPO3PG_CTRL1: 1st GPO3 PG Control Register (offset = AAh) [reset = X]
      47. 7.13.47 GPO3PG_CTRL2: 2nd GPO3 PG Control Register (offset = ABh) [reset = X]
      48. 7.13.48 MISCSYSPG Register (offset = ACh) [reset = X]
        1. 7.13.48.1 VTT_DISCH_CTRL Register (offset = ADh) [reset = X]
      49. 7.13.49 LDOA1_SWB2_CTRL: LDOA1 and SWB2 Control Register (offset = AEh) [reset = X]
      50. 7.13.50 PG_STATUS1: 1st Power Good Status Register (offset = B0h) [reset = 0000 0000]
      51. 7.13.51 PG_STATUS2: 2nd Power Good Status Register (offset = B1h) [reset = 0000 0000]
      52. 7.13.52 PWR_FAULT_STATUS1: 1st Power Fault Status Register (offset = B2h) [reset = 0000 0000]
      53. 7.13.53 PWR_FAULT_STATUS2: 2nd Power Fault Status Register (offset = B3h) [reset = 0000 0000]
      54. 7.13.54 TEMPCRIT: Temperature Fault Status Register (offset = B4h) [reset = 0000 0000]
      55. 7.13.55 TEMPHOT: Temperature Hot Status Register (offset = B5h) [reset = 0000 0000]
      56. 7.13.56 OC_STATUS: Overcurrent Fault Status Register (offset = B6h) [reset = 0000 0000]
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Controller Design Procedure
          1. 8.2.2.1.1 Selecting the Inductor
          2. 8.2.2.1.2 Selecting the Output Capacitors
          3. 8.2.2.1.3 Selecting the FETs
          4. 8.2.2.1.4 Bootstrap Capacitor
          5. 8.2.2.1.5 Setting the Current Limit
          6. 8.2.2.1.6 Selecting the Input Capacitors
        2. 8.2.2.2 Converter Design Procedure
          1. 8.2.2.2.1 Selecting the Inductor
          2. 8.2.2.2.2 Selecting the Output Capacitors
          3. 8.2.2.2.3 Selecting the Input Capacitors
        3. 8.2.2.3 LDO Design Procedure
      3. 8.2.3 Application Curves
      4. 8.2.4 Layout
        1. 8.2.4.1 Layout Guidelines
        2. 8.2.4.2 Layout Example
      5. 8.2.5 VIN 5-V Application
        1. 8.2.5.1 Design Requirements
        2. 8.2.5.2 Design Procedure
        3. 8.2.5.3 Application Curves
    3. 8.3 Power Supply Coupling and Bulk Capacitors
    4. 8.4 Do's and Don'ts
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 9.1.2 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3 TPS6508640 Design and Settings

The TPS6508640 device is optimized to power the higher range of the Xilinx Zynq Ultrascale+ MPSoC, but is compatible with the lower range as well. See Figure 7-3 for an example block diagram. Dashed lines show the option to short VCCINT with VCCBRAM for cases where their voltages are the same and current < 25 A. In this case, the TPS544C25 device is not needed and GPO1 should be shorted to CTL4.

TPS650864 TPS6508640 Power Map Example
(1) External FETs can be scaled to meet the current requirements of each design; CSD87381P is suitable up to approximately 15 A.
(2) The TPS6508640 is not limited to the ZU7CG - ZU15EG. It can support other Ultrascale+ devices as long as the use case does not exceed the maximum specifications of the TPS6508640.
Figure 7-3 TPS6508640 Power Map Example

The power up and power down sequences can be seen in Figure 7-4 and Figure 7-5. Regulators and GPOs are enabled by combination of CTL pins and regulator power good signals.

TPS650864 TPS6508640 Power-Up Sequence Figure 7-4 TPS6508640 Power-Up Sequence
TPS650864 TPS6508640 Power-Down Sequence Figure 7-5 TPS6508640 Power-Down Sequence

TPS6508640 sequence includes an optional slot for an external rail to power VCCINT. When using an external rail, GPO1 should be connected to the enable of the external rail and the power good of the external rail should be connected to CTL4. When merging VCCINT and VCCBRAM, GPO1 can be connected directly to CTL4.

CTL1 and CTL5 are used to enable the portion of the sequencing related to DDR memory. This includes BUCK6, LDOA1, and VTT LDO. Connecting the CTL1 pin to the same input as CTL3 will result in BUCK6 being enabled 2 ms after BUCK5 and LDOA1 being enabled after BUCK6 PG. If CTL5 is connected to the same input as well, VTT LDO will turn on after BUCK6 PG as well.

CTL2 is used to select DDR voltage between 1.2 V (logic level low) and 1.35 V (logic level high).

CTL6 is used to select BUCK2 (VCCBRAM) voltage between 0.85 V (logic level low) and 0.9 V (logic level high). BUCK3 also has SLP_EN = 1b by default, so if using 0.85 V for VCCBRAM (CTL6 logic level low), then to modify BUCK3 VID during operation, BUCK3_SLP_VID register bits should be used.

LDOA2 and LDOA3 are controlled only by I2C.

A summary of the part number specific settings can be seen in Section 7.3.1.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |