SLVS849C July   2008  – September 2017 TPS65100-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Main Boost Converter
      2. 7.3.2 VCOM Buffer
      3. 7.3.3 Positive Charge Pump
      4. 7.3.4 Negative Charge Pump
      5. 7.3.5 Linear Regulator Controller
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable and Power-ON Sequencing (EN, ENR)
      2. 7.4.2 Soft Start
      3. 7.4.3 Fault Protection
      4. 7.4.4 Thermal Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Supply for a Typical Approximately 7-inch Display
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Boost Converter Design Procedure
            1. 8.2.1.2.1.1 Inductor Selection
            2. 8.2.1.2.1.2 Output Capacitor Selection
            3. 8.2.1.2.1.3 Input Capacitor Selection
            4. 8.2.1.2.1.4 Rectifier Diode Selection
            5. 8.2.1.2.1.5 Converter Loop Design and Stability
            6. 8.2.1.2.1.6 Design Procedure Quick Steps
            7. 8.2.1.2.1.7 Setting the Output Voltage and Selecting the Feedforward Capacitor
          2. 8.2.1.2.2 Negative Charge Pump
          3. 8.2.1.2.3 Positive Charge Pump
            1. 8.2.1.2.3.1 Voltage Doubler Mode
            2. 8.2.1.2.3.2 Voltage Tripler Mode
          4. 8.2.1.2.4 VCOM Buffer
          5. 8.2.1.2.5 Linear Regulator Controller
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Supply for a Typical Approximately 8-inch Display
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation see the following:

  • PowerPAD Thermally Enhanced Package, SLMA002
  • PowerPAD Made Easy, SLMA004
  • How to Compensate with the TPS6510x and TPS6514x, SLVA813.
  • Basic Calculation of a Boost Converter's Power Stage, SLVA372
  • Customizing Your TPS6510x/TPS6514x, SLVA192
  • Power Management Guide 2016 at www.ti.com

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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