10.1 Layout Guidelines

For all switching power supplies, the layout is an important step in the design, especially at high-peak currents and switching frequencies. If the layout is not carefully designed, the regulator might show stability and EMI problems. TI recommends the following PCB layout guidelines for the TPS65100-Q1 device:

• Connect PGND and AGND together on the same ground plane.
• Connect all capacitor grounds and PGND together on a common ground plane.
• Place the input filter capacitor as close as possible to the input pin of the IC.
• Route first the traces carrying high-switching currents with wide and short traces.
• Isolate analog signal paths from power paths.
• If vias are necessary, try to use more than one in parallel to decrease parasitics, especially for power traces.
• Solder the thermal pad to the PCB for good thermal performance

10.2 Layout Example

Figure 20. Layout Example

10.3 Thermal Considerations

An influential component of thermal performance of a package is board design. To take full advantage of the heat dissipation abilities of the PowerPAD package with exposed thermal die, a board that acts similar to a heat sink and allows the use of an exposed (and solderable) deep downset pad should be used. For further information, see PowerPAD Thermally Enhanced Package, SLMA002, and PowerPAD Made Easy, SLMA004.