SLVS496D SEPTEMBER   2003  – August 2016 TPS65100 , TPS65101 , TPS65105

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Dissipation Ratings
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Main Boost Converter
      2. 8.3.2  VCOM Buffer
      3. 8.3.3  Enable and Power-On Sequencing
      4. 8.3.4  Positive Charge Pump
      5. 8.3.5  Negative Charge Pump
      6. 8.3.6  Linear Regulator Controller
      7. 8.3.7  Soft Start
      8. 8.3.8  Fault Protection
      9. 8.3.9  Thermal Shutdown
      10. 8.3.10 Linear Regulator Controller
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable and Disable
      2. 8.4.2 Fault Mode
        1. 8.4.2.1 Overvoltage Protection
        2. 8.4.2.2 Short-Circuit Protection
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Boost Converter Design Procedure
          1. 9.2.2.1.1 Inductor Selection
          2. 9.2.2.1.2 Output Capacitor Selection
          3. 9.2.2.1.3 Input Capacitor Selection
          4. 9.2.2.1.4 Rectifier Diode Selection
          5. 9.2.2.1.5 Converter Loop Design and Stability
          6. 9.2.2.1.6 Design Procedure Quick Steps
          7. 9.2.2.1.7 Setting the Output Voltage and Selecting the Feedforward Capacitor
        2. 9.2.2.2 Negative Charge Pump
        3. 9.2.2.3 Positive Charge Pump
        4. 9.2.2.4 VCOM Buffer
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Notebook Supply
      2. 9.3.2 Monitor Supply
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Performance
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resource
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGE|24
  • PWP|24
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Documentation Support

12.2.1 Related Documentation

For related documentation see the following:

12.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 7. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TPS65100 Click here Click here Click here Click here Click here
TPS65101 Click here Click here Click here Click here Click here
TPS65105 Click here Click here Click here Click here Click here

12.4 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.5 Community Resource

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.6 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

12.7 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.8 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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