ZHCSF63A September   2013  – June 2016 TPS65154

PRODUCTION DATA.  

  1. 1 器件概述
    1. 1.1 特性
    2. 1.2 应用范围
    3. 1.3 说明
    4. 1.4 简化系统图
  2. 2 修订历史记录
  3. 3 Pin Configuration and Functions
  4. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Timing Requirements
  5. 5 Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1  Linear Regulator (VCC)
        1. 5.3.1.1 Power-Up (Linear Regulator)
        2. 5.3.1.2 Power-Down (Linear Regulator)
        3. 5.3.1.3 Protection (Linear Regulator)
      2. 5.3.2  Boost Converter 1 (AVDD)
        1. 5.3.2.1 Power-Up (Boost Converter 1)
        2. 5.3.2.2 Power-Down (Boost Converter 1)
        3. 5.3.2.3 Protection (Boost Converter 1)
      3. 5.3.3  Boost Converter 2 (VGH)
        1. 5.3.3.1 Power-Up (Boost Converter 2)
        2. 5.3.3.2 Power-Down (Boost Converter 2)
        3. 5.3.3.3 Protection (Boost Converter 2)
      4. 5.3.4  Negative Charge Pump (VGL)
        1. 5.3.4.1 Power-Up (Negative Charge Pump)
        2. 5.3.4.2 Power-Down (Negative Charge Pump)
        3. 5.3.4.3 Protection (Negative Charge Pump)
      5. 5.3.5  Gate Voltage Shaping
      6. 5.3.6  Panel Discharge (XAO)
      7. 5.3.7  Reset Generator (RST)
      8. 5.3.8  Programmable VCOM
        1. 5.3.8.1 Operational Amplifier Performance
        2. 5.3.8.2 Power-Up (Programmable VCOM)
        3. 5.3.8.3 Power-Down (Programmable VCOM)
      9. 5.3.9  WLED Driver
        1. 5.3.9.1 WLED Boost Converter
        2. 5.3.9.2 Current Sinks
        3. 5.3.9.3 Protection
        4. 5.3.9.4 Enable and Start-Up
      10. 5.3.10 Undervoltage Lockout
    4. 5.4 Device Functional Modes
      1. 5.4.1 Dimming Modes
        1. 5.4.1.1 Direct Dimming
        2. 5.4.1.2 Phase-Shift Dimming
      2. 5.4.2 Power Sequencing
        1. 5.4.2.1 Power-Up
        2. 5.4.2.2 Power-Down
    5. 5.5 Programming
      1. 5.5.1 Configuration
        1. 5.5.1.1 General
          1. 5.5.1.1.1 I2C Interface
          2. 5.5.1.1.2 Slave Addresses
          3. 5.5.1.1.3 Write Protect
      2. 5.5.2 Programming Examples (Excluding VCOM)
        1. 5.5.2.1 Writing to a Single RAM Register
        2. 5.5.2.2 Writing to Multiple RAM Registers
        3. 5.5.2.3 Saving Contents of all RAM Registers to EEPROM
        4. 5.5.2.4 Reading from a Single RAM Register
        5. 5.5.2.5 Reading from a Single EEPROM Register
        6. 5.5.2.6 Reading from Multiple RAM Registers
        7. 5.5.2.7 Reading from Multiple EEPROM Registers
      3. 5.5.3 Programming Examples - VCOM
        1. 5.5.3.1 Writing a VCOM Value of 77h to WR
        2. 5.5.3.2 Writing a VCOM Value of 77h to IVR and WR
        3. 5.5.3.3 Reading a VCOM Value of 77h from WR
        4. 5.5.3.4 Reading a VCOM Value of 77h from IVR
    6. 5.6 Register Map
      1. 5.6.1 Configuration Registers (Excluding VCOM)
        1. 5.6.1.1  CONFIG (00h)
        2. 5.6.1.2  VCC (01h)
        3. 5.6.1.3  DLY1 (02h)
        4. 5.6.1.4  AVDD (03h)
        5. 5.6.1.5  FSW1 (04h)
        6. 5.6.1.6  SS2 (05h)
        7. 5.6.1.7  DLY2 (06h)
        8. 5.6.1.8  VGL (07h)
        9. 5.6.1.9  SS3 (08h)
        10. 5.6.1.10 DLY3 (09h)
        11. 5.6.1.11 VGH (0Ah)
        12. 5.6.1.12 SS4 (0Bh)
        13. 5.6.1.13 FSW3 (0Ch)
        14. 5.6.1.14 DLY4 (0Dh)
        15. 5.6.1.15 OVP (0Eh)
        16. 5.6.1.16 FDIM (OFh)
        17. 5.6.1.17 RESET (10h)
        18. 5.6.1.18 VDET (11h)
        19. 5.6.1.19 DLY6 (12h)
        20. 5.6.1.20 VMAX (13h)
        21. 5.6.1.21 VMIN (14h)
        22. 5.6.1.22 USER (15h)
        23. 5.6.1.23 CONTROL (FFh)
      2. 5.6.2 VCOM Registers
        1. 5.6.2.1 VCOM DATA (Slave Address 28h, Register Address 00h)
        2. 5.6.2.2 VCOM CONTROL (Slave Address 28h, Register Address 02h)
  6. 6 Application and Implementation
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Design Requirements
      2. 6.2.2 Detailed Design Procedure
        1. 6.2.2.1 External Component Selection
      3. 6.2.3 Application Curves
  7. 7 Power Supply Recommendations
  8. 8 Layout
    1. 8.1 Layout Guidelines
    2. 8.2 Layout Example
  9. 9 器件和文档支持
    1. 9.1 器件支持
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 接收文档更新通知
    3. 9.3 社区资源
    4. 9.4 商标
    5. 9.5 静电放电警告
    6. 9.6 Glossary
  10. 10机械、封装和可订购信息
    1. 10.1 封装信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

2 修订历史记录

Changes from * Revision (September 2013) to A Revision

  • Changed 数据表为数据手册格式Go
  • Added 器件信息表，ESD 额定值表，特性 描述部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分。Go
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