ZHCSIX2 October   2018 TPS65216

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 简化原理图
  2. 2Pin Configuration and Functions
    1. 2.1 Pin Functions
      1.      Pin Functions
  3. 3Specifications
    1. 3.1 Absolute Maximum Ratings
    2. 3.2 ESD Ratings
    3. 3.3 Recommended Operating Conditions
    4. 3.4 Thermal Information
    5. 3.5 Electrical Characteristics
    6. 3.6 Timing Requirements
    7. 3.7 Typical Characteristics
  4. 4Detailed Description
    1. 4.1 Overview
    2. 4.2 Functional Block Diagram
    3. 4.3 Feature Description
      1. 4.3.1 Wake-Up and Power-Up and Power-Down Sequencing
        1. 4.3.1.1  Power-Up Sequencing
        2. 4.3.1.2  Power-Down Sequencing
        3. 4.3.1.3  Strobes 1 and 2
        4. 4.3.1.4  Supply Voltage Supervisor and Power Good (PGOOD)
        5. 4.3.1.5  Internal LDO (INT_LDO)
        6. 4.3.1.6  Current Limited Load Switch
        7. 4.3.1.7  LDO1
        8. 4.3.1.8  UVLO
        9. 4.3.1.9  Power-Fail Comparator
        10. 4.3.1.10 DCDC3 / DCDC4 Power-Up Default Selection
        11. 4.3.1.11 I/O Configuration
          1. 4.3.1.11.1 Using GPIO2 as Reset Signal to DCDC1 and DCDC2
        12. 4.3.1.12 Push Button Input (PB)
          1. 4.3.1.12.1 Signaling PB-Low Event on the nWAKEUP Pin
          2. 4.3.1.12.2 Push Button Reset
        13. 4.3.1.13 AC_DET Input (AC_DET)
        14. 4.3.1.14 Interrupt Pin (INT)
        15. 4.3.1.15 I2C Bus Operation
    4. 4.4 Device Functional Modes
      1. 4.4.1 Modes of Operation
      2. 4.4.2 OFF
      3. 4.4.3 ACTIVE
      4. 4.4.4 SUSPEND
      5. 4.4.5 RESET
    5. 4.5 Register Maps
      1. 4.5.1 Password Protection
      2. 4.5.2 FLAG Register
      3. 4.5.3 TPS65216Registers
        1. 4.5.3.1  CHIPID Register (subaddress = 0x0) [reset = 0x5]
          1. Table 4-7 CHIPID Register Field Descriptions
        2. 4.5.3.2  INT1 Register (subaddress = 0x1) [reset = 0x0]
          1. Table 4-8 INT1 Register Field Descriptions
        3. 4.5.3.3  INT2 Register (subaddress = 0x2) [reset = 0x0]
          1. Table 4-9 INT2 Register Field Descriptions
        4. 4.5.3.4  INT_MASK1 Register (subaddress = 0x3) [reset = 0x0]
          1. Table 4-10 INT_MASK1 Register Field Descriptions
        5. 4.5.3.5  INT_MASK2 Register (subaddress = 0x4) [reset = 0x0]
          1. Table 4-11 INT_MASK2 Register Field Descriptions
        6. 4.5.3.6  STATUS Register (subaddress = 0x5) [reset = 00XXXXXXb]
          1. Table 4-12 STATUS Register Field Descriptions
        7. 4.5.3.7  CONTROL Register (subaddress = 0x6) [reset = 0x0]
          1. Table 4-13 CONTROL Register Field Descriptions
        8. 4.5.3.8  FLAG Register (subaddress = 0x7) [reset = 0x0]
          1. Table 4-14 FLAG Register Field Descriptions
        9. 4.5.3.9  PASSWORD Register (subaddress = 0x10) [reset = 0x0]
          1. Table 4-15 PASSWORD Register Field Descriptions
        10. 4.5.3.10 ENABLE1 Register (subaddress = 0x11) [reset = 0x0]
          1. Table 4-16 ENABLE1 Register Field Descriptions
        11. 4.5.3.11 ENABLE2 Register (subaddress = 0x12) [reset = 0x0]
          1. Table 4-17 ENABLE2 Register Field Descriptions
        12. 4.5.3.12 CONFIG1 Register (subaddress = 0x13) [reset = 0x4C]
          1. Table 4-18 CONFIG1 Register Field Descriptions
        13. 4.5.3.13 CONFIG2 Register (subaddress = 0x14) [reset = 0xC0]
          1. Table 4-19 CONFIG2 Register Field Descriptions
        14. 4.5.3.14 CONFIG3 Register (subaddress = 0x15) [reset = 0x0]
          1. Table 4-20 CONFIG3 Register Field Descriptions
        15. 4.5.3.15 DCDC1 Register (offset = 0x16) [reset = 0x99]
          1. Table 4-21 DCDC1 Register Field Descriptions
        16. 4.5.3.16 DCDC2 Register (subaddress = 0x17) [reset = 0x99]
          1. Table 4-22 DCDC2 Register Field Descriptions
        17. 4.5.3.17 DCDC3 Register (subaddress = 0x18) [reset = 0x8C]
          1. Table 4-23 DCDC3 Register Field Descriptions
        18. 4.5.3.18 DCDC4 Register (subaddress = 0x19) [reset = 0xB2]
          1. Table 4-24 DCDC4 Register Field Descriptions
        19. 4.5.3.19 SLEW Register (subaddress = 0x1A) [reset = 0x6]
          1. Table 4-25 SLEW Register Field Descriptions
        20. 4.5.3.20 LDO1 Register (subaddress = 0x1B) [reset = 0x1F]
          1. Table 4-26 LDO1 Register Field Descriptions
        21. 4.5.3.21 SEQ1 Register (subaddress = 0x20) [reset = 0x0]
          1. Table 4-27 SEQ1 Register Field Descriptions
        22. 4.5.3.22 SEQ2 Register (subaddress = 0x21) [reset = 0x0]
          1. Table 4-28 SEQ2 Register Field Descriptions
        23. 4.5.3.23 SEQ3 Register (subaddress = 0x22) [reset = 0x98]
          1. Table 4-29 SEQ3 Register Field Descriptions
        24. 4.5.3.24 SEQ4 Register (subaddress = 0x23) [reset = 0x75]
          1. Table 4-30 SEQ4 Register Field Descriptions
        25. 4.5.3.25 SEQ5 Register (subaddress = 0x24) [reset = 0x12]
          1. Table 4-31 SEQ5 Register Field Descriptions
        26. 4.5.3.26 SEQ6 Register (subaddress = 0x25) [reset = 0x63]
          1. Table 4-32 SEQ6 Register Field Descriptions
        27. 4.5.3.27 SEQ7 Register (subaddress = 0x26) [reset = 0x3]
          1. Table 4-33 SEQ7 Register Field Descriptions
  5. 5Application and Implementation
    1. 5.1 Application Information
    2. 5.2 Typical Application
      1. 5.2.1 Design Requirements
      2. 5.2.2 Detailed Design Procedure
        1. 5.2.2.1 Output Filter Design
        2. 5.2.2.2 Inductor Selection for Buck Converters
        3. 5.2.2.3 Output Capacitor Selection
      3. 5.2.3 Application Curves
  6. 6Power Supply Recommendations
  7. 7Layout
    1. 7.1 Layout Guidelines
    2. 7.2 Layout Example
  8. 8器件和文档支持
    1. 8.1 器件支持
      1. 8.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 8.2 文档支持
      1. 8.2.1 相关文档
    3. 8.3 接收文档更新通知
    4. 8.4 社区资源
    5. 8.5 商标
    6. 8.6 静电放电警告
    7. 8.7 Glossary
  9. 9机械、封装和可订购信息
    1. 9.1 Package Option Addendum
      1. 9.1.1 Packaging Information
      2. 9.1.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4.3.1.13 AC_DET Input (AC_DET)

The AC_DET pin is a CMOS-type input used in three different ways to control the power-up of the PMIC:

  • In a battery operated system, AC_DET is typically connected to an external battery charger with an open-drain power-good output pulled low when a valid charger supply is connected to the system. A falling edge on the AC_DET pin causes the PMIC to power up.
  • In a non-portable system, the AC_DET pin may be shorted to ground and the IC powers up whenever system power is applied to the chip.
  • If none of the above behaviors are desired, AC_DET may be tied to system power (IN_BIAS). Power-up is then controlled through the push-button input or PWR_EN input.

TPS65216 ac_det_pin_cfg_lds206.gif
A. Portable Systems
B. Non-portable Systems
C. Disabled
Figure 4-17 AC_DET Pin Configurations
TPS65216 AC_DET_input_deg_lds206.gifFigure 4-18 AC_DET Input Deglitch and Power-Up Timing (Portable Systems)

In ACTIVE state, the TPS65216 monitors the AC_DET input and issues an interrupt when the pin status changes, such as when it drops below or rises above the AC_DET input-low or input-high thresholds. The interrupt is masked by the ACM bit in the INT_MASK1 register.

TPS65216 ac_state_pin_lds206.gifFigure 4-19 AC_STATE Pin

NOTE

Interrupts are issued whenever the AC_DET pin status changes. The AC_STATE bit reflects the current status of the AC_DET input.
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