ZHCSG04F january   2017  – may 2023 TPS65235-1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Boost Converter
      2. 7.3.2  Linear Regulator and Current Limit
      3. 7.3.3  Boost Converter Current Limit
      4. 7.3.4  Charge Pump
      5. 7.3.5  Slew Rate Control
      6. 7.3.6  Short-Circuit Protection, Hiccup, and Overtemperature Protection
      7. 7.3.7  Tone Generation
      8. 7.3.8  Tone Detection
      9. 7.3.9  Audio Noise Rejection
      10. 7.3.10 Disable and Enable
      11. 7.3.11 Component Selection
        1. 7.3.11.1 Boost Inductor
        2. 7.3.11.2 Capacitor Selection
        3. 7.3.11.3 Surge Components
        4. 7.3.11.4 Consideration for Boost Filtering and LNB Noise
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Serial Interface Description
      2. 7.5.2 TPS65235-1 I2C Update Sequence
    6. 7.6 Register Maps
      1. 7.6.1 Control Register 1 (address = 0x00) [reset = 0x08]
      2. 7.6.2 Control Register 2 (address = 0x01) [reset = 0x09]
      3. 7.6.3 Status Register (address = 0x02) [reset = 0x29]
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 DiSEqc1.x Support
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DiSEqc2.x Support
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Capacitor Selection

The TPS65235-1 device has a 1-MHz nonsynchronous boost converter integrated and the boost converter features the internal compensation network. The TPS65235-1 device works well with both ceramic capacitor and electrolytic capacitor.

The recommended ceramic capacitors for the TPS65235-1 application are, at the minimum, rated as X7R/X5R, with a 35-V rating, and a 1206 size for the achieving lower LNB output ripple. Table 7-1 lists the recommended ceramic capacitors list for both 4.7-µH and 10-µH boost inductors.

If more cost-effictive design is needed, use a 100-µF electrolytic (low ESR) and a 10-µF or 35-V ceramic capacitor.

Table 7-1 Boost Inductor and Capacitor Selections
BOOST INDUCTORCAPACITORSTOLERANCE (%)RATING (V)SIZE
10 µH2 × 22 µF±10351206
2 × 10 µF±10351206
4.7 µH2 × 22 µF±10351206
2 × 10 µF±10351206
22 µF±10351206

Figure 7-6 and Figure 7-7 show a bode plot of boost loop with 4.7-µH and 10-µH inductance and 4 µF, 5 µF, 7.5 µF, 10 µF, 15 µF, and 20 µF of boost capacitance after degrading. As the boost capacitance increases, the phase margin increases.

GUID-F8AD8767-B462-4DBA-8345-5C6FFD2A8B2A-low.gifFigure 7-6 Gain and Phase Margin of the Boost Loop With Different Boost Capacitance (VIN = 12 V, VOUT = 18.2 V, ILOAD = 1 A, fSW = 1 MHz, 4.7 µH, Typical Bode Plot)
GUID-FC56A8EB-9229-422B-9565-F43AAE988877-low.gifFigure 7-7 Gain and Phase Margin of the Boost Loop With Different Boost Capacitance (VIN = 12 V, VOUT = 18.2 V, ILOAD = 1 A, fSW = 1 MHz, 10 µH, Typical Bode Plot)