ZHCSHO2G June   2010  – February 2018 TPS65251

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用原理图
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Adjustable Switching Frequency
      2. 8.3.2  Synchronization
      3. 8.3.3  Out-of-Phase Operation
      4. 8.3.4  Delayed Start-Up
      5. 8.3.5  Soft-Start Time
      6. 8.3.6  Adjusting the Output Voltage
      7. 8.3.7  Input Capacitor
      8. 8.3.8  Bootstrap Capacitor
      9. 8.3.9  Error Amplifier
      10. 8.3.10 Loop Compensation
      11. 8.3.11 Slope Compensation
      12. 8.3.12 Powergood
      13. 8.3.13 Current Limit Protection
      14. 8.3.14 Overvoltage Transient Protection
      15. 8.3.15 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Low-Power Mode Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Loop Compensation Circuit
        2. 9.2.2.2  Selecting the Switching Frequency
        3. 9.2.2.3  Output Inductor Selection
        4. 9.2.2.4  Output Capacitor
        5. 9.2.2.5  Input Capacitor
        6. 9.2.2.6  Soft-Start Capacitor
        7. 9.2.2.7  Bootstrap Capacitor Selection
        8. 9.2.2.8  Adjustable Current Limiting Resistor Selection
        9. 9.2.2.9  Output Voltage and Feedback Resistors Selection
        10. 9.2.2.10 Compensation
        11. 9.2.2.11 3.3-V and 6.5-V LDO Regulators
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) TPS65251 UNIT
RHA (VQFN)
40 PINS
RθJA Junction-to-ambient thermal resistance 30 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 25.3 °C/W
RθJB Junction-to-board thermal resistance 73 °C/W
ψJT Junction-to-top characterization parameter 0.2 °C/W
ψJB Junction-to-board characterization parameter 7.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
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