ZHCSCZ1B june   2014  – may 2023 TPS65262-1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Adjusting the Output Voltage
      2. 8.3.2  Enable and Adjusting UVLO
      3. 8.3.3  Soft-Start Time
      4. 8.3.4  Power-Up Sequencing
        1. 8.3.4.1 External Power Sequencing
        2. 8.3.4.2 Automatic Power Sequencing
      5. 8.3.5  V7V Low Dropout Regulator and Bootstrap
      6. 8.3.6  Out-of-Phase Operation
      7. 8.3.7  Output Overvoltage Protection (OVP)
      8. 8.3.8  PSM
      9. 8.3.9  Slope Compensation
      10. 8.3.10 Overcurrent Protection (OCP)
        1. 8.3.10.1 High-Side MOSFET OCP
        2. 8.3.10.2 Low-Side MOSFET OCP
      11. 8.3.11 Power Good
      12. 8.3.12 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation With VIN < 4.5 V (Minimum VIN)
      2. 8.4.2 Operation With EN Control
      3. 8.4.3 Operation at Light Loads
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Inductor Selection
        2. 9.2.2.2 Output Capacitor Selection
        3. 9.2.2.3 Input Capacitor Selection
        4. 9.2.2.4 Loop Compensation
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 静电放电警告
    5. 10.5 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.2 ESD Ratings

MIN MAX UNIT
V (ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) –2000 2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) –500 500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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