ZHCSCV2C june   2014  – may 2023 TPS65263

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Adjusting the Output Voltage
      2. 8.3.2  Enable and Adjusting UVLO
      3. 8.3.3  Soft-Start Time
      4. 8.3.4  Power-Up Sequencing
      5. 8.3.5  V7V Low Dropout Regulator and Bootstrap
      6. 8.3.6  Out-of-Phase Operation
      7. 8.3.7  Output Overvoltage Protection (OVP)
      8. 8.3.8  Pulse Skipping Mode (PSM)
      9. 8.3.9  Slope Compensation
      10. 8.3.10 Overcurrent Protection
        1. 8.3.10.1 High-Side MOSFET Overcurrent Protection
        2. 8.3.10.2 Low-Side MOSFET Overcurrent Protection
      11. 8.3.11 Power Good
      12. 8.3.12 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Serial Interface Description
      2. 8.4.2 I2C Update Sequence
    5. 8.5 Register Maps
      1. 8.5.1 Register Description
      2. 8.5.2 VOUT1_SEL: Vout1 Voltage Selection Register (offset = 0x00H)
      3. 8.5.3 VOUT2_SEL: Vout2 Voltage Selection Register (offset = 0x01H)
      4. 8.5.4 VOUT3_SEL: Vout3 Voltage Selection Register (offset = 0x02H)
      5. 8.5.5 VOUT1_COM: Buck1 Command Register (offset = 0x03H)
      6. 8.5.6 VOUT2_COM: Buck2 Command Register (offset = 0x04H)
      7. 8.5.7 VOUT3_COM: Buck3 Command Register (offset = 0x05H)
      8. 8.5.8 SYS_STATUS: System Status Register (offset = 0x06H)
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Inductor Selection
        2. 9.2.2.2 Output Capacitor Selection
        3. 9.2.2.3 Input Capacitor Selection
        4. 9.2.2.4 Loop Compensation
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 静电放电警告
    5. 10.5 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted) (1)
MINMAXUNIT
VoltagePVIN1, PVIN2, PVIN3,VIN–0.320V
LX1, LX2, LX3 (maximum withstand voltage transient <20 ns)–1.020
BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively–0.37
EN1, EN2, EN3, V7V, VOUT1, VOUT2, VOUT3, SCL, SDA–0.37
FB1, FB2, FB3, COMP1, COMP2, COMP3, SS1, SS2, SS3–0.33.6
AGND, PGND1, PGND2, PGND3–0.30.3
TJOperating junction temperature–40125°C
Tstg Storage temperature range –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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