ZHCSCV2C june   2014  – may 2023 TPS65263

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Adjusting the Output Voltage
      2. 8.3.2  Enable and Adjusting UVLO
      3. 8.3.3  Soft-Start Time
      4. 8.3.4  Power-Up Sequencing
      5. 8.3.5  V7V Low Dropout Regulator and Bootstrap
      6. 8.3.6  Out-of-Phase Operation
      7. 8.3.7  Output Overvoltage Protection (OVP)
      8. 8.3.8  Pulse Skipping Mode (PSM)
      9. 8.3.9  Slope Compensation
      10. 8.3.10 Overcurrent Protection
        1. 8.3.10.1 High-Side MOSFET Overcurrent Protection
        2. 8.3.10.2 Low-Side MOSFET Overcurrent Protection
      11. 8.3.11 Power Good
      12. 8.3.12 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Serial Interface Description
      2. 8.4.2 I2C Update Sequence
    5. 8.5 Register Maps
      1. 8.5.1 Register Description
      2. 8.5.2 VOUT1_SEL: Vout1 Voltage Selection Register (offset = 0x00H)
      3. 8.5.3 VOUT2_SEL: Vout2 Voltage Selection Register (offset = 0x01H)
      4. 8.5.4 VOUT3_SEL: Vout3 Voltage Selection Register (offset = 0x02H)
      5. 8.5.5 VOUT1_COM: Buck1 Command Register (offset = 0x03H)
      6. 8.5.6 VOUT2_COM: Buck2 Command Register (offset = 0x04H)
      7. 8.5.7 VOUT3_COM: Buck3 Command Register (offset = 0x05H)
      8. 8.5.8 SYS_STATUS: System Status Register (offset = 0x06H)
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Inductor Selection
        2. 9.2.2.2 Output Capacitor Selection
        3. 9.2.2.3 Input Capacitor Selection
        4. 9.2.2.4 Loop Compensation
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 静电放电警告
    5. 10.5 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision B (May 2023) to Revision C (May 2023)

Changes from Revision A (September 2014) to Revision B (May 2023)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • Changed the description of V7V pin in Table 6-1.Go
  • Renamed Handling Ratings to ESD Ratings Go
  • Moved the storage temperature row in the ESD Ratings table to the Absolute Maximum Ratings tableGo
  • Changed the recommended value of capacitor from V7V pin to power ground in V7V Low Dropout Regulator and Bootstrap .Go
  • Changed all instances of legacy terminology to controller and target where I2C is mentioned.Go
  • Changed the recommended value of C9 in the typical application schematicGo

Changes from Revision * (June 2014) to Revision A (September 2014)

  • 将器件状态从“米6体育平台手机版_好二三四预发布”更改为“量产数据”Go
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