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ZHCSFL3 October 2016 TPS65266-1

PRODUCTION DATA.

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted) ⁽¹⁾

		MIN	MAX	UNIT
Voltage at	VIN1, VIN2, VIN3, VINQ	–0.3	7	V
	LX1, LX2, LX3 (maximum withstand voltage transient <20 ns)	–1.0	7
	BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively	–0.3	7
	EN1, EN2, EN3, PGOOD	–0.3	7
	FB1, FB2, FB3, COMP1 , COMP2, COMP3, SS1, SS2, SS3, ROSC	–0.3	3.6
	AGND, PGND1, PGND2, PGND3	–0.3	0.3
T_J	Operating junction temperature	–30	125	°C
T_stg	Storage temperature	–55	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾	±2000	V
V_(ESD)	Electrostatic discharge	Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾	±500	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

		MIN	MAX	UNIT
Voltage at	VIN1, VIN2, VIN3, VINQ	2.7	6	V
	LX1, LX2, LX3 (maximum withstand voltage transient <20 ns)	–0.8	6
	BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively	–0.1	6
	EN1, EN2, EN3, PGOOD	–0.1	6
	FB1, FB2, FB3, COMP1 , COMP2, COMP3, SS1, SS2, SS3, ROSC	–0.1	3
T_J	Operating junction temperature	–30	125	°C

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TPS65266-1	UNIT
		RHB
		32-PIN VQFN
R_θJA	Junction-to-ambient thermal resistance	34.2	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	27.5	°C/W
R_θJB	Junction-to-board thermal resistance	8.3	°C/W
ψ_JT	Junction-to-top characterization parameter	0.4	°C/W
ψ_JB	Junction-to-board characterization parameter	8.3	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	2.8	°C/W

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

T_J = –30°C to 125°C, V_IN= 5 V, typical values are at T_J = 25°C, (unless otherwise noted)

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
INPUT SUPPLY VOLTAGE
V_IN	Input voltage range		2.7		6	V
UVLO	VIN undervoltage lockout	V_IN rising	2.35	2.45	2.6	V
UVLO	VIN undervoltage lockout	V_IN falling	2.15	2.25	2.37	V
I_DD(SDN)	Shutdown supply current	EN1 = EN2 = EN3 = 0 V		9		µA
I_{DD(Q_NSW)}	Input quiescent current without buck1/2/3 switching	EN1 = EN2 = EN3 = 5 V, FB1 = FB2 = FB3 = 0.8 V		790		µA
I_{DD(Q_NSW1)}		EN1 = 5 V, EN2 = EN3 = 0 V, FB1 = 0.8 V		340		µA
I_{DD(Q_NSW2)}		EN2 = 5 V, EN1 = EN3 = 0 V, FB2 = 0.8 V		340		µA
I_{DD(Q_NSW3)}		EN3 = 5 V, EN1 = EN2 = 0 V, FB3 = 0.8 V		340		µA
BUCK1, BUCK2, BUCK3
V_FB	Feedback voltage	V_COMP = 1.2 V	0.594	0.6	0.606	V
V_EN(XH)	EN1/2/3 high-level input voltage			1.2	1.26	V
V_EN(XL)	EN1/2/3 low-level input voltage		1.1	1.15		V
I_EN(X1)	EN1/2/3 pullup current	ENx = 1 V	1.7	2.1	2.5	µA
I_EN(X2)	EN1/2/3 pullup current	ENx = 1.3 V		5.3		µA
I_EN(hys)	Hysteresis current			3.2		µA
I_SSX	Soft-start charging current		4.5	5.5	6.5	µA
G_{(m_PS1/2/3)}	COMP1/2/3 voltage to inductor current G_m⁽²⁾	I_LX = 0.5 A		10		A/V
I_(LIMIT1)	Buck1 peak inductor current limit		3.55	4.6	5.6	A
I_(LIMITSINK1)	Buck1 low-side sink current limit			1.4
I_(LIMIT2/3)	Buck2/3 peak inductor current limit		2.35	3.1	3.7	A
I_{(LIMITSINK2/3)}	Buck2/3 low-side sink current limit			1.2		A
R_{ds(on)_HS1}	Buck1 high-side switch resistance⁽¹⁾	VINQ = 5 V		45		mΩ
R_{ds(on)_LS1}	Buck1 low-side switch resistance⁽¹⁾	VINQ = 5 V		50		mΩ
R_{ds(on)_HS2}	Buck2 high-side switch resistance⁽¹⁾	VINQ = 5 V		60		mΩ
R_{ds(on)_LS2}	Buck2 low-side switch resistance⁽¹⁾	VINQ = 5 V		60		mΩ
R_{ds(on)_HS3}	Buck3 high-side switch resistance⁽¹⁾	VINQ = 5 V		60		mΩ
R_{ds(on)_LS3}	Buck3 low-side switch resistance⁽¹⁾	VINQ = 5 V		60		mΩ
POWER GOOD
V_{(th_PG)}	Feedback voltage threshold	FBx undervoltage falling		92.5		%VREF
V_{(th_PG)}	Feedback voltage threshold	FBx undervoltage rising		95		%VREF
I_PG	PGOOD pin leakage				1	µA
V_{(LOW_PG)}	PGOOD pin low voltage	I_(SINK) = 1 mA			0.4	V
OSCILLATOR
F_SW	Switching frequency	R_(OSC) = 51.1 kΩ	920	1000	1080	kHz
F_SW(range)	Switching frequency		250		2400	kHz
F_(SYNC)	Clock sync frequency range		250		2400	kHz
F_{(SYNC_HI)}	Clock sync high threshold				2	V
V_{(SYNC_LO)}	Clock sync low threshold		0.4			V
THERMAL PROTECTION
T_{(TRIP_OTP)}⁽²⁾	Thermal protection trip point	Temperature rising		160		°C
T_{(HYST_OTP)}⁽²⁾	Thermal protection trip point	Hysteresis		20		°C

(1) Typical value without bonding wires; from design simulation

(2) Lab validation result

6.6 Timing Requirements

			MIN	NOM	MAX	UNIT
BUCK1, BUCK2, BUCK3
t_{ON_MIN}	Minimum on-time			80	115	ns
G_{m_EA}	Error amplifier transconductance	–2 µA < I_(COMPX) < 2 µA		290		µS
HICCUP TIMING
t_{Hiccup_wait}	Overcurrent wait time⁽²⁾			512		cycles
t_{Hiccup_re}	Hiccup time before restart⁽²⁾			16382		cycles
POWER GOOD
t_{DEGLITCH(PG)_F}	PGOOD falling edge deglitch time			128		cycles
t_{RDEGLITCH(PG)_R}	PGOOD rising edge deglitch time			16350		cycles
OSCILLATOR
t_{SYNC_w}	Clock sync minimum pulse duration		80			ns

6.7 Typical Characteristics

T_A = 25°C, V_IN = 5 V, V_OUT1 = 1.0 V, V_OUT2 = 1.5 V, V_OUT3 = 1.8 V F_SW = 1 MHz (unless otherwise noted)

Figure 1. Buck1 Efficiency

Figure 3. Buck3 Efficiency

Figure 5. Buck2, Load Regulation

Figure 7. Buck1, Line Regulation

Figure 9. Buck3, Line Regulation

	ROSC = 51.1 kΩ

Figure 11. Oscillator Frequency vs Temperature

V_IN = 5 V	EN = 1 V

Figure 13. EN Pin Pullup Current vs Temperature, EN = 1 V

	V_IN = 5 V

Figure 15. EN Pin Threshold Rising vs Temperature

	V_IN = 5 V

Figure 17. SS Pin Charge Current vs Temperature

	V_IN = 5 V

Figure 19. Buck2 High-Side Current Limit vs Temperature

Figure 2. Buck2 Efficiency

Figure 4. Buck1, Load Regulation

Figure 6. Buck3, Load Regulation

Figure 8. Buck2, Line Regulation

Figure 10. Voltage Reference vs Temperature

	V_IN = 5 V

Figure 12. Shutdown Quiescent Current vs Temperature

V_IN = 5 V	EN = 1.3 V

Figure 14. EN Pin Pullup Current vs Temperature, EN = 1.3 V

	V_IN = 5 V

Figure 16. EN Pin Threshold Falling vs Temperature

	V_IN = 5 V

Figure 18. Buck1 High-Side Current Limit vs Temperature

	V_IN = 5 V

Figure 20. Buck3 High-Side Current Limit vs Temperature