SWCS046U March   2010  – October 2014 TPS65910

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3 Device Comparison
  4. 4Terminal Configuration and Functions
    1. 4.1 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Handling Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Resistance Characteristics for RSL Package
    5. 5.5  I/O Pullup and Pulldown Characteristics
    6. 5.6  Digital I/O Voltage Electrical Characteristics
    7. 5.7  I2C Interface and Control Signals
    8. 5.8  Power Consumption
    9. 5.9  Power References and Thresholds
    10. 5.10 Thermal Monitoring and Shutdown
    11. 5.11 32-kHz RTC Clock
    12. 5.12 Backup Battery Charger
    13. 5.13 VRTC LDO
    14. 5.14 VIO SMPS
    15. 5.15 VDD1 SMPS
    16. 5.16 VDD2 SMPS
    17. 5.17 VDD3 SMPS
    18. 5.18 VDIG1 and VDIG2 LDO
    19. 5.19 VAUX33 and VMMC LDO
    20. 5.20 VAUX1 and VAUX2 LDO
    21. 5.21 VDAC and VPLL LDO
    22. 5.22 Timing and Switching Characteristics
      1. 5.22.1 Switch-On/-Off Sequences and Timing
        1. 5.22.1.1 BOOT1 = 0, BOOT0 = 0
        2. 5.22.1.2 BOOT1 = 0, BOOT0 = 1
      2. 5.22.2 Power Control Timing
        1. 5.22.2.1 Device Turn-On/Off With Rising/Falling Input Voltage
        2. 5.22.2.2 Device State Control Through PWRON Signal
        3. 5.22.2.3 Device SLEEP State Control
        4. 5.22.2.4 Power Supplies State Control Through the SCLSR_EN1 and SDASR_EN2 Signals
        5. 5.22.2.5 VDD1 and VDD2 Voltage Control Through SCLSR_EN1 and SDASR_EN2 Signals
        6. 5.22.2.6 SMPS Switching Synchronization
  6. 6Detailed Description
    1. 6.1  Power Reference
    2. 6.2  Power Sources
    3. 6.3  Embedded Power Controller
      1. 6.3.1 State-Machine
      2. 6.3.2 Switch-On/-Off Sequences
      3. 6.3.3 Control Signals
        1. 6.3.3.1 SLEEP
        2. 6.3.3.2 PWRHOLD
        3. 6.3.3.3 BOOT0/BOOT1
        4. 6.3.3.4 NRESPWRON
        5. 6.3.3.5 CLK32KOUT
        6. 6.3.3.6 PWRON
        7. 6.3.3.7 INT1
        8. 6.3.3.8 SDASR_EN2 and SCLSR_EN1
        9. 6.3.3.9 GPIO_CKSYNC
      4. 6.3.4 Dynamic Voltage Frequency Scaling and Adaptive Voltage Scaling Operation
    4. 6.4  32-kHz RTC Clock
    5. 6.5  RTC
      1. 6.5.1 Time Calendar Registers
      2. 6.5.2 General Registers
      3. 6.5.3 Compensation Registers
    6. 6.6  Backup Battery Management
    7. 6.7  Backup Registers
    8. 6.8  I2C Interface
    9. 6.9  Thermal Monitoring and Shutdown
    10. 6.10 Interrupts
    11. 6.11 Package Description
    12. 6.12 Functional Registers
      1. 6.12.1 TPS65910_FUNC_REG Registers Mapping Summary
      2. 6.12.2 TPS65910_FUNC_REG Register Descriptions
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
      2. 7.1.2 Device Nomenclature
    2. 7.2 Documentation Support
    3. 7.3 Related Links
    4. 7.4 Community Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Export Control Notice
    8. 7.8 Glossary
    9. 7.9 Additional Acronyms
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Packaging Information

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7 Device and Documentation Support

7.1 Device Support

7.1.1 Development Support

TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tool's support documentation is electronically available within the Code Composer Studio™ Integrated Development Environment (IDE).

The following products support development of the TPS65910 device applications:

Software Development Tools: Code Composer Studio™ Integrated Development Environment (IDE): including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target software needed to support any TPS65910 device application.

Hardware Development Tools: Extended Development System (XDS™) Emulator

For a complete listing of development-support tools for the TPS65910 platform, visit the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.

7.1.2 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, TPS65910). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS).

Device development evolutionary flow:

    XExperimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    PPrototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDXDevelopment-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDSFully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RSL) and the temperature range (for example, blank is the default commercial temperature range).

For orderable part numbers of TPS65910x devices in the RSL package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.

7.2 Documentation Support

The following documents describe the TPS65910 device. Copies of these documents are available on the Internet at www.ti.com.

    SWCA139TPS65910x Schematic Checklist
    SWCU078TPS65910 User Guide for OMAP3 Family of Processors
    SWCU093TPS65910Ax User's Guide for AM335x Processors
    SWCU071TPS65910 User Guide for OMAPL137, OMAPL138 and C674x
    SWCA089TPS65910 User Guide for AM3517/AM3505 Processor
    SWCU073TPS659107 User Guide for i.MX27 and i.MX35 Processors
    SWCU074TPS659105 User Guide for DaVinci Family Processors

7.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 7-1 Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TPS65910 Click here Click here Click here Click here Click here
TPS65910A Click here Click here Click here Click here Click here
TPS65910A3 Click here Click here Click here Click here Click here
TPS659101 Click here Click here Click here Click here Click here
TPS659102 Click here Click here Click here Click here Click here
TPS659103 Click here Click here Click here Click here Click here
TPS659104 Click here Click here Click here Click here Click here
TPS659105 Click here Click here Click here Click here Click here
TPS659106 Click here Click here Click here Click here Click here
TPS659107 Click here Click here Click here Click here Click here
TPS659108 Click here Click here Click here Click here Click here
TPS659109 Click here Click here Click here Click here Click here

7.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

7.5 Trademarks

SmartReflex, E2E are trademarks of Texas Instruments.

7.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

7.7 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.

7.8 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

7.9 Additional Acronyms

Additional acronyms used in this data sheet are described below.

ACRONYM DEFINITION
DDR Dual-Data Rate (memory)
ES Engineering Sample
ESD Electrostatic Discharge
FET Field Effect Transistor
EPC Embedded Power Controller
FSM Finite State Machine
GND Ground
GPIO General-Purpose I/O
HBM Human Body Model
HD Hot-Die
HS-I2C High-Speed I2C
I2C Inter-Integrated Circuit
IC Integrated Circuit
ID Identification
IDDQ Quiescent supply current
IEEE Institute of Electrical and Electronics Engineers
IR Instruction Register
I/O Input/Output
JEDEC Joint Electron Device Engineering Council
JTAG Joint Test Action Group
LBC7 Lin Bi-CMOS 7 (360 nm)
LDO Low Drop Output voltage linear regulator
LP Low-Power application mode
LSB Least Significant Bit
MMC Multimedia Card
MOSFET Metal Oxide Semiconductor Field Effect Transistor
NVM Nonvolatile Memory
OMAP™ Open Multimedia Application Platform™
RTC Real-Time Clock
SMPS Switched Mode Power Supply
SPI Serial Peripheral Interface
POR Power-On Reset
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