SWCS046U March   2010  – October 2014 TPS65910

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3 Device Comparison
  4. 4Terminal Configuration and Functions
    1. 4.1 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Handling Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Resistance Characteristics for RSL Package
    5. 5.5  I/O Pullup and Pulldown Characteristics
    6. 5.6  Digital I/O Voltage Electrical Characteristics
    7. 5.7  I2C Interface and Control Signals
    8. 5.8  Power Consumption
    9. 5.9  Power References and Thresholds
    10. 5.10 Thermal Monitoring and Shutdown
    11. 5.11 32-kHz RTC Clock
    12. 5.12 Backup Battery Charger
    13. 5.13 VRTC LDO
    14. 5.14 VIO SMPS
    15. 5.15 VDD1 SMPS
    16. 5.16 VDD2 SMPS
    17. 5.17 VDD3 SMPS
    18. 5.18 VDIG1 and VDIG2 LDO
    19. 5.19 VAUX33 and VMMC LDO
    20. 5.20 VAUX1 and VAUX2 LDO
    21. 5.21 VDAC and VPLL LDO
    22. 5.22 Timing and Switching Characteristics
      1. 5.22.1 Switch-On/-Off Sequences and Timing
        1. 5.22.1.1 BOOT1 = 0, BOOT0 = 0
        2. 5.22.1.2 BOOT1 = 0, BOOT0 = 1
      2. 5.22.2 Power Control Timing
        1. 5.22.2.1 Device Turn-On/Off With Rising/Falling Input Voltage
        2. 5.22.2.2 Device State Control Through PWRON Signal
        3. 5.22.2.3 Device SLEEP State Control
        4. 5.22.2.4 Power Supplies State Control Through the SCLSR_EN1 and SDASR_EN2 Signals
        5. 5.22.2.5 VDD1 and VDD2 Voltage Control Through SCLSR_EN1 and SDASR_EN2 Signals
        6. 5.22.2.6 SMPS Switching Synchronization
  6. 6Detailed Description
    1. 6.1  Power Reference
    2. 6.2  Power Sources
    3. 6.3  Embedded Power Controller
      1. 6.3.1 State-Machine
      2. 6.3.2 Switch-On/-Off Sequences
      3. 6.3.3 Control Signals
        1. 6.3.3.1 SLEEP
        2. 6.3.3.2 PWRHOLD
        3. 6.3.3.3 BOOT0/BOOT1
        4. 6.3.3.4 NRESPWRON
        5. 6.3.3.5 CLK32KOUT
        6. 6.3.3.6 PWRON
        7. 6.3.3.7 INT1
        8. 6.3.3.8 SDASR_EN2 and SCLSR_EN1
        9. 6.3.3.9 GPIO_CKSYNC
      4. 6.3.4 Dynamic Voltage Frequency Scaling and Adaptive Voltage Scaling Operation
    4. 6.4  32-kHz RTC Clock
    5. 6.5  RTC
      1. 6.5.1 Time Calendar Registers
      2. 6.5.2 General Registers
      3. 6.5.3 Compensation Registers
    6. 6.6  Backup Battery Management
    7. 6.7  Backup Registers
    8. 6.8  I2C Interface
    9. 6.9  Thermal Monitoring and Shutdown
    10. 6.10 Interrupts
    11. 6.11 Package Description
    12. 6.12 Functional Registers
      1. 6.12.1 TPS65910_FUNC_REG Registers Mapping Summary
      2. 6.12.2 TPS65910_FUNC_REG Register Descriptions
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
      2. 7.1.2 Device Nomenclature
    2. 7.2 Documentation Support
    3. 7.3 Related Links
    4. 7.4 Community Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Export Control Notice
    8. 7.8 Glossary
    9. 7.9 Additional Acronyms
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

2 Revision History

VERSION DATE NOTES
* 03/2010 See (1)
A 05/2010 See (2)
B 06/2010 See (3)
C 06/2010 See (4)
D 11/2010 See (5)
E 01/2011 See (6)
F 01/2011 See (7)
G 05/2011 See (8)
H 06/2011 See (9)
I 07/2011 See (10)
J 10/2011 See (11)
K 10/2011 See (12)
L 01/2012 See (13)
M 03/2012 See (14)
N 04/2012 See (15)
O 06/2012 See (16)
P 09/2012 See (17)
Q 09/2012 See (18)
R 02/2013 See (19)
S 08/2013 See (20)
T 09/2013 See (21)
U 10/2014 See (22)
(1) Initial release
(2) SWCS046A: Updated register tables VMMC_REG and VDAC_REG. Added register table VPLL_REG
(3) SWCS046B: Updated Absolute Maximum Ratings, Recommended Operating Conditions, I/O Pullup and Pulldown Characteristics, Digital I/Os Voltage Electrical Characteristics, Power Consumption, Power References and Thresholds, Thermal Monitoring and Shutdown, 32-kHz RTC Clock, VRTC LDO, VIO SMPS, VDD1 SMPS, VDD2 SMPS, VDD3 SMPS, Switch-On/-Off Sequences and Timing
(4) SWCS046C: Associate parts; no change.
(5) SWCS046D: Updated Recommended Operating Conditions - Backup Battery, I/O Pullup and Pulldown Characteristics, Backup Battery Charger. Update Rated output current, PMOS current limit (High-Side), NMOS current limit (Low-Side), and Conversion Efficiency for VIO SMPS, VDD1/VDD2/VDD3 SMPS and VDIG1/VDIG2 LDO. Update Input Voltage for VIO/VDD1/VDD2 SMPS. Update DC and Transient Load and Line Regulation and Internal Resistance for VDIG1/VDIG2 LDO, VAUX33/VMMC LDO, VAUX1,VAUX2, LDO, and VDAC/VPLL LDO. Update DC Load Regulation for VAUX3/VMMC/VDAC. Update Power Control Timing. Add Device SLEEP State Control. Add SMPS Switching Synchronization. Update VIO_REG, VDD1_REG, and VDD2_REG.
(6) SWCS046E: Manually added Thermal Pad Mechanical Data.
(7) SWCS046F: UpdatedTable 3-1, SUPPORTED PROCESSORS AND CORRESPONDING PART NUMBERS.
(8) SWCS046G: Updated Section 6.11, Section 5.3, Section 5.6, and Section 6.3.3.6.
(9) SWCS046H: Updated Table 6-29, PUADEN_REG, Table 6-61, RESERVED, and Table 6-62, RESERVED.
(10) SWCS046I: Updated DC Output voltage VOUT in Section 5.20.
(11) SWCS046J: UpdatedTable 3-1, SUPPORTED PROCESSORS AND CORRESPONDING PART NUMBERS.
(12) SWCS046K: UpdateTable 3-1, SUPPORTED PROCESSORS AND CORRESPONDING PART NUMBERS - Add AM335x.
(13) SWCS046L: Updated Table 3-1, SUPPORTED PROCESSORS AND CORRESPONDING PART NUMBERS - Add AM335x with DDR2 and AM335x with DDR3.
(14) SWCS046M: Updated Section 6.3.1, - Update Device Sleep enable conditions control information.
(15) SWCS046N:
(16) SWCS046O: Updated Table 5-5, Power Control Timing Characteristics
  • Replace unit of µs for tdbPWRONF by ms
(17) SWCS046P: Updated Table 3-1, SUPPORTED PROCESSORS AND CORRESPONDING PART NUMBERS -
  • Add AM335x with DDR3 - TPS65910A31A1RSL
  • Add Rockchip - RK30xx
(18) SWCS046Q: Updated Table 3-1, SUPPORTED PROCESSORS AND CORRESPONDING PART NUMBERS -
  • Refer to SWCU093 document: Updated document reference from TBD to SWCU093
(19) SWCS046R: Updated Section 5.13, VRTC LDO - Changed Input Voltage - Back-up mode - Max from 3V to 5.5V.
(20) SWCS046S: Updated Section 5.20, VAUX1 AND VAUX2 LDO - Changed VAUX2 - Rated Output Current IOUTmax - On mode from 150 mA to 300 mA
(21) SWCS046T: Updated
  • Table 6-23, RTC_Reset_Status_Reg, Changed Reserved bits to 7:1 and changed RESET_STATUS's reset value to 0x0.
  • Table 6-34, VDD1_OP_REG, Changed SEL Vout to Vout = (SEL[6:0] × 12.5 mV + 0.5625 V) × G.
  • Table 6-35, VDD1_SR_REG, Changed SEL Vout to Vout = (SEL[6:0] × 12.5 mV + 0.5625 V) × G.
  • Table 6-37, VDD2_OP_REG, Changed SEL Vout to Vout = (SEL[6:0] × 12.5 mV + 0.5625 V) × G.
  • Table 6-38, VDD2_SR_REG, Changed SEL Vout to Vout = (SEL[6:0] × 12.5 mV + 0.5625 V) × G.
(22) SWCS046U: Updated data sheet to latest TI standards
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