ZHCSI09S June   2010  – August 2018 TPS65911

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2修订历史记录
  3. 3Device Comparison Table
  4. 4Pin Configuration and Functions
    1. 4.1 Pin Attributes
      1.      Pin Attributes
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: I/O Pullup and Pulldown
    6. 5.6  Electrical Characteristics: Digital I/O Voltage
    7. 5.7  Electrical Characteristics: Power Consumption
    8. 5.8  Electrical Characteristics: Power References and Thresholds
    9. 5.9  Electrical Characteristics: Thermal Monitoring and Shutdown
    10. 5.10 Electrical Characteristics: 32-kHz RTC Clock
    11. 5.11 Electrical Characteristics: Backup Battery Charger
    12. 5.12 Electrical Characteristics: VRTC LDO
    13. 5.13 Electrical Characteristics: VIO SMPS
    14. 5.14 Electrical Characteristics: VDD1 SMPS
    15. 5.15 Electrical Characteristics: VDD2 SMPS
    16. 5.16 Electrical Characteristics: VDDCtrl SMPS
    17. 5.17 Electrical Characteristics: LDO1 and LDO2
    18. 5.18 Electrical Characteristics: LDO3 and LDO4
    19. 5.19 Electrical Characteristics: LDO5
    20. 5.20 Electrical Characteristics: LDO6, LDO7, and LDO8
    21. 5.21 Timing and Switching Characteristics
      1. 5.21.1 I2C Timing and Switching
      2. 5.21.2 Switch-ON and Switch-OFF Sequences and Timing
      3. 5.21.3 Power Control Timing
        1. 5.21.3.1 Device State Control Through PWRON Signal
        2. 5.21.3.2 Device SLEEP State Control
        3. 5.21.3.3 Device Turnon and Turnoff With Rising and Falling Input Voltage
        4. 5.21.3.4 Power Supplies State Control Through EN1 and EN2 Signals
        5. 5.21.3.5 VDD1, VDD2 Voltage Control Through EN1 and EN2 Signals
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Power Reference
    4. 6.4  Power Resources
    5. 6.5  Embedded Power Controller (EPC)
      1. 6.5.1 State Machine
        1. 6.5.1.1 Device POWER ON Enable Conditions
        2. 6.5.1.2 Device POWER ON Disable Conditions
        3. 6.5.1.3 Device SLEEP Enable Conditions
        4. 6.5.1.4 Device Reset Scenarios
      2. 6.5.2 BOOT Configuration, Switch-ON, and Switch-OFF Sequences
      3. 6.5.3 Control Signals
        1. 6.5.3.1  SLEEP
        2. 6.5.3.2  PWRHOLD
        3. 6.5.3.3  BOOT1
        4. 6.5.3.4  NRESPWRON, NRESPWRON2
        5. 6.5.3.5  CLK32KOUT
        6. 6.5.3.6  PWRON
        7. 6.5.3.7  INT1
        8. 6.5.3.8  EN2 and EN1
        9. 6.5.3.9  GPIO0 to GPIO8
        10. 6.5.3.10 HDRST Input
        11. 6.5.3.11 PWRDN
        12. 6.5.3.12 Comparators: COMP1 and COMP2
        13. 6.5.3.13 Watchdog
        14. 6.5.3.14 Tracking LDO
    6. 6.6  PWM and LED Generators
    7. 6.7  Dynamic Voltage Frequency Scaling and Adaptive Voltage Scaling Operation
    8. 6.8  32-kHz RTC Clock
    9. 6.9  Real Time Clock (RTC)
      1. 6.9.1 Time Calendar Registers
      2. 6.9.2 General Registers
      3. 6.9.3 Compensation Registers
    10. 6.10 Backup Battery Management
    11. 6.11 Backup Registers
    12. 6.12 I2C Interface
      1. 6.12.1 Access Protocols
        1. 6.12.1.1 Single Byte Access
        2. 6.12.1.2 Multiple Byte Access to Several Adjacent Registers
    13. 6.13 Thermal Monitoring and Shutdown
    14. 6.14 Interrupts
    15. 6.15 Register Maps
      1. 6.15.1 Functional Registers
        1. 6.15.1.1 TPS65911_FUNC_REG Registers Mapping Summary
        2. 6.15.1.2 TPS65911_FUNC_REG Register Descriptions
  7. 7Applications, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 External Component Recommendation
        2. 7.2.2.2 Controller Design Procedure
          1. 7.2.2.2.1 Inductor Selection
          2. 7.2.2.2.2 Selecting the RTRIP Resistor
          3. 7.2.2.2.3 Selecting the Output Capacitors
          4. 7.2.2.2.4 Selecting FETs
          5. 7.2.2.2.5 Bootstrap Capacitor
          6. 7.2.2.2.6 Selecting Input Capacitors
        3. 7.2.2.3 Converter Design Procedure
          1. 7.2.2.3.1 Selecting the Inductor
          2. 7.2.2.3.2 Selecting Output Capacitors
          3. 7.2.2.3.3 Selecting Input Capacitors
      3. 7.2.3 Application Curves
      4. 7.2.4 Layout Guidelines
        1. 7.2.4.1 PCB Layout
      5. 7.2.5 Layout Example
    3. 7.3 Power Supply Recommendations
  8. 8器件和文档支持
    1. 8.1 器件支持
      1. 8.1.1 开发支持
      2. 8.1.2 器件命名规则
    2. 8.2 文档支持
      1. 8.2.1 相关文档
    3. 8.3 接收文档更新通知
    4. 8.4 社区资源
      1. 8.4.1 社区资源
    5. 8.5 商标
    6. 8.6 静电放电警告
    7. 8.7 术语表
  9. 9机械、封装和可订购信息
    1. 9.1 封装 说明

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Power Resources

The power resources provided by the TPS65911 device include inductor based switched mode power supplies (SMPSs) and linear low-dropout voltage regulators (LDOs). These supply resources provide the required power to the external processor cores and external components, and to modules embedded in the TPS65911 device.

Two of the integrated SMPSs and the external FET SMPS have voltage scaling capability. These SMPSs provide independent core voltage domains to the host processor. When changing the output voltage, VDD1 and VDD2 reach the new value through successive steps of 2.5 to 12.5 mV. The size of the voltage step is selected by the TSTEP bit. VDDCtrl has a target slew rate of 100 mV/20 µs. New output values are reached in successive smaller steps of N × LSB, LSB = 12.5 mV, N = 1 to 4. A suitable combination of steps is calculated internally based on current and new target value for output voltage.

The VIO SMPS provides supply voltage for the host processor I/Os.

Table 6-1 lists the power sources provided by the TPS65911 device.

Table 6-1 Power Sources

RESOURCE TYPE VOLTAGES POWER
VIO SMPS 1.5 V 1300 mA
1.8 V 1200 mA
2.5 or 3.3 V 1100 mA
VDD1 SMPS 0.6 to 2.2 V 1500 mA
3.2 V 1200 mA
1.2 or 1.35 or 1.5 V (VINmin = 3 V) 2000 mA
0.6 ... 1.5 V in 12.5-mV steps
Programmable multiplication factor: ×2, ×3. Maximum output 3.3 V
VDD2 SMPS 0.6 to 1.5 V 1500 mA
2.2 / 3.2 V 1200 mA
0.6 ... 1.5 V in 12.5-mV steps
Programmable multiplication factor: ×2, ×3. Maximum output 3.3 V
VDDCtrl SMPS 0.6 … 1.4 V in 12.5-mV steps External component dependent
LDO1 LDO 1.0–3.3 V, 0.05-V step 320 mA
LDO2 LDO 1.0–3.3 V, 0.05-V step 320 mA
LDO3 LDO 1.0–3.3 V, 0.1-V step 200 mA
LDO4 LDO 1.0–3.3 V, 0.05-V step 50 mA
LDO5 LDO 1.0–3.3 V, 0.1-V step 300 mA
LDO6 LDO 1.0–3.3 V, 0.1-V step 300 mA
LDO7 LDO 1.0–3.3 V, 0.1-V step 300 mA
LDO8 LDO 1.0–3.3 V, 0.1-V step 300 mA
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