ZHCSGS5A August   2017  – February 2019 TPS65919-Q1

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能图
  2. 2修订历史记录
  3. 3Pin Configuration and Functions
    1. 3.1 Pin Attributes
      1.      Pin Attributes
    2. 3.2 Signal Descriptions
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Information
    5. 4.5  Electrical Characteristics — LDO Regulators
    6. 4.6  Electrical Characteristics — SMPS1&2 in Dual-Phase Configuration
    7. 4.7  Electrical Characteristics — SMPS1, SMPS2, SMPS3, and SMPS4 Stand-Alone Regulators
    8. 4.8  Electrical Characteristics — Reference Generator (Bandgap)
    9. 4.9  Electrical Characteristics — 32-kHz RC Oscillators and SYNCCLKOUT Output Buffers
    10. 4.10 Electrical Characteristics — 12-Bit Sigma-Delta ADC
    11. 4.11 Electrical Characteristics — Thermal Monitoring and Shutdown
    12. 4.12 Electrical Characteristics — System Control Thresholds
    13. 4.13 Electrical Characteristics — Current Consumption
    14. 4.14 Electrical Characteristics — Digital Input Signal Parameters
    15. 4.15 Electrical Characteristics — Digital Output Signal Parameters
    16. 4.16 I/O Pullup and Pulldown Characteristics
    17. 4.17 Electrical Characteristics — I2C Interface
    18. 4.18 Timing Requirements — I2C Interface
    19. 4.19 Timing Requirements — SPI
    20. 4.20 Switching Characteristics — LDO Regulators
    21. 4.21 Switching Characteristics — SMPS1&2 in Dual-Phase Configuration
    22. 4.22 Switching Characteristics — SMPS1, SMPS2, SMPS3, and SMPS4 Stand-Alone Regulators
    23. 4.23 Switching Characteristics — Reference Generator (Bandgap)
    24. 4.24 Switching Characteristics — PLL for SMPS Clock Generation
    25. 4.25 Switching Characteristics — 32-kHz RC Oscillators and SYNCCLKOUT Output Buffers
    26. 4.26 Switching Characteristics — 12-Bit Sigma-Delta ADC
    27. 4.27 Typical Characteristics
  5. 5Detailed Description
    1. 5.1  Overview
    2. 5.2  Functional Block Diagram
    3. 5.3  Device State Machine
      1. 5.3.1  Embedded Power Controller
      2. 5.3.2  State Transition Requests
        1. 5.3.2.1 ON Requests
        2. 5.3.2.2 OFF Requests
        3. 5.3.2.3 SLEEP and WAKE Requests
      3. 5.3.3  Power Sequences
      4. 5.3.4  Device Power Up Timing
      5. 5.3.5  Power-On Acknowledge
        1. 5.3.5.1 POWERHOLD Mode
        2. 5.3.5.2 AUTODEVON Mode
      6. 5.3.6  BOOT Configuration
        1. 5.3.6.1 Boot Pin Usage and Connection
      7. 5.3.7  Reset Levels
      8. 5.3.8  INT
      9. 5.3.9  Warm Reset
      10. 5.3.10 RESET_IN
    4. 5.4  Power Resources (Step-Down and Step-Up SMPS Regulators, LDOs)
      1. 5.4.1 Step-Down Regulators
        1. 5.4.1.1 Output Voltage and Mode Selection
        2. 5.4.1.2 Clock Generation for SMPS
        3. 5.4.1.3 Current Monitoring and Short Circuit Detection
        4. 5.4.1.4 POWERGOOD
        5. 5.4.1.5 DVS-Capable Regulators
          1. 5.4.1.5.1 Non DVS-Capable Regulators
        6. 5.4.1.6 Step-Down Converters SMPS1, SMPS2 or SMPS1&2
        7. 5.4.1.7 Step-Down Converters SMPS3, and SMPS4
      2. 5.4.2 Low Dropout Regulators (LDOs)
        1. 5.4.2.1 LDOVANA
        2. 5.4.2.2 LDOVRTC
        3. 5.4.2.3 LDO1 and LDO2
        4. 5.4.2.4 Low-Noise LDO (LDO5)
        5. 5.4.2.5 Other LDOs
    5. 5.5  SMPS and LDO Input Supply Connections
    6. 5.6  First Supply Detection
    7. 5.7  Long-Press Key Detection
    8. 5.8  12-Bit Sigma-Delta General-Purpose ADC (GPADC)
      1. 5.8.1 Asynchronous Conversion Request (SW)
      2. 5.8.2 Periodic Conversion (AUTO)
      3. 5.8.3 Calibration
    9. 5.9  General-Purpose I/Os (GPIO Pins)
    10. 5.10 Thermal Monitoring
      1. 5.10.1 Hot-Die Function (HD)
      2. 5.10.2 Thermal Shutdown
    11. 5.11 Interrupts
    12. 5.12 Control Interfaces
      1. 5.12.1 I2C Interfaces
        1. 5.12.1.1 I2C Implementation
        2. 5.12.1.2 F/S Mode Protocol
        3. 5.12.1.3 HS Mode Protocol
      2. 5.12.2 Serial Peripheral Interface (SPI)
        1. 5.12.2.1 SPI Modes
        2. 5.12.2.2 SPI Protocol
    13. 5.13 OTP Configuration Memory
    14. 5.14 Watchdog Timer (WDT)
    15. 5.15 System Voltage Monitoring
    16. 5.16 Register Map
      1. 5.16.1 Functional Register Mapping
    17. 5.17 Device Identification
  6. 6Applications, Implementation, and Layout
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Design Requirements
      2. 6.2.2 Detailed Design Procedure
        1. 6.2.2.1 SMPS Input Capacitors
        2. 6.2.2.2 SMPS Output Capacitors
        3. 6.2.2.3 SMPS Inductors
        4. 6.2.2.4 LDO Input Capacitors
        5. 6.2.2.5 LDO Output Capacitors
        6. 6.2.2.6 VCCA
          1. 6.2.2.6.1 Meeting the Power-Down Sequence
          2. 6.2.2.6.2 Maintaining Sufficient Input Voltage
        7. 6.2.2.7 VIO_IN
        8. 6.2.2.8 GPADC
      3. 6.2.3 Application Curves
    3. 6.3 Layout
      1. 6.3.1 Layout Guidelines
      2. 6.3.2 Layout Example
    4. 6.4 Power Supply Coupling and Bulk Capacitors
  7. 7器件和文档支持
    1. 7.1 器件支持
      1. 7.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 7.1.2 器件命名规则
    2. 7.2 文档支持
      1. 7.2.1 相关文档
    3. 7.3 接收文档更新通知
    4. 7.4 社区资源
    5. 7.5 商标
    6. 7.6 静电放电警告
    7. 7.7 Glossary
  8. 8机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.2.2.6.2 Maintaining Sufficient Input Voltage

In the event of high loading during loss of input voltage, there is a risk to go below the voltage level necessary for the internal logic of the device to work properly before the device is disabled. This means that when the VCCA voltage supply level becomes lower than the VSYS_LO threshold, the input voltage may continue dropping to very low voltages during the 180 us ±10% delay before the device is disabled.

If a large input voltage drop occurs before the device is disabled, the internal logic can no longer properly drive the FETs of the SMPS, and it is possible that the high-side FET and low-side FET of the SMPS are on at the same time. In the event that the high-side and low-side FETs for an SMPS are on at the same time, there is a direct path from SMPSx_IN to GND, allowing cross-conduction and possible damage of the device.

In order to prevent damage or irregular switching behavior, it is important that the voltage at the SMPSx_IN pin stays above 1.8 V, including negative transients, before the device is disabled. The minimum voltage seen at the SMPSx_IN pin is dependent on VCCA and the PCB inductance between the SMPSx_IN pin and the input capacitor. Use Equation 2 to determine the minimum capacitance needed on VCCA to ensure that the device continues switching properly before it is disabled.

Equation 2. C = I × ΔT / (VSYS_LO – VCCAMIN)

where

  • C is total capacitance on VCCA, including preregulator output capacitance and PMIC input capacitance
  • I is the total current on the PMIC input supply
  • ΔT is the maximum debounce time after VCCA = VSYS_LO before the device switches off (198us)
  • VSYS_LO is the threshold where the device is disabled
  • VCCAMIN is the minimum VCCA voltage to keep the SMPSx_IN transients above 1.8 V

When measuring the SMPSx_IN and VCCA during power down, use active differential probes and a high resolution oscilloscope (4GS/sec or more). VCCA can be measured over the 10uF input capacitor. However, SMPSx_IN must be measured at the pin in order to measure the transients on this rail accurately. To measure SMPSx_IN, place the negative lead of the differential probe at a nearby GND, such as the GND of the SMPSx_IN input capacitor. Place the positive lead of the differential probe directly on the exposed metal of the SMPSx_IN pin. With this set up, verify that SMPSx_IN, including the ripple on this signal, does not drop below 1.8V before the SMPS stops switching. See Figure 6-4 for an example of how to take this measurement. For ways to decrease the amplitude of the transient spikes, see Table 6-3 for recommended parasitic inductance requirements.

TPS65919-Q1 tps6591x-q1-waveform-of-smpsx_in-transients.gifFigure 6-4 Waveform of SMPSx_IN Transients
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