ZHCSNX8B December   2020  – September 2023 TPS6593-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
    1.     5
  5. Revision History
  6. 说明(续)
  7. Pin Configuration and Functions
    1. 6.1 Digital Signal Descriptions
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  General Purpose Low Drop-Out Regulators (LDO1, LDO2, LDO3)
    6. 7.6  Low Noise Low Drop-Out Regulator (LDO4)
    7. 7.7  Internal Low Drop-Out Regulators (LDOVRTC, LDOVINT)
    8. 7.8  BUCK1, BUCK2, BUCK3, BUCK4 and BUCK5 Regulators
    9. 7.9  Reference Generator (BandGap)
    10. 7.10 Monitoring Functions
    11. 7.11 Clocks, Oscillators, and PLL
    12. 7.12 Thermal Monitoring and Shutdown
    13. 7.13 System Control Thresholds
    14. 7.14 Current Consumption
    15. 7.15 Backup Battery Charger
    16. 7.16 Digital Input Signal Parameters
    17. 7.17 Digital Output Signal Parameters
    18. 7.18 I/O Pullup and Pulldown Resistance
    19. 7.19 I2C Interface
    20. 7.20 Serial Peripheral Interface (SPI)
    21. 7.21 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  System Supply Voltage Monitor
      2. 8.3.2  Power Resources (Bucks and LDOs)
        1. 8.3.2.1 Buck Regulators
          1. 8.3.2.1.1  BUCK Regulator Overview
          2. 8.3.2.1.2  Multi-Phase Operation and Phase-Adding or Shedding
          3. 8.3.2.1.3  Transition Between PWM and PFM Modes
          4. 8.3.2.1.4  Multi-Phase BUCK Regulator Configurations
          5. 8.3.2.1.5  Spread-Spectrum Mode
          6. 8.3.2.1.6  Adaptive Voltage Scaling (AVS) and Dynamic Voltage Scaling (DVS) Support
          7. 8.3.2.1.7  BUCK Output Voltage Setting
          8. 8.3.2.1.8  BUCK Regulator Current Limit
          9. 8.3.2.1.9  SW_Bx Short-to-Ground Detection
          10. 8.3.2.1.10 Sync Clock Functionality
          11.        49
        2. 8.3.2.2 Low Dropout Regulators (LDOs)
          1. 8.3.2.2.1 LDOVINT
          2. 8.3.2.2.2 LDOVRTC
          3. 8.3.2.2.3 LDO1, LDO2, and LDO3
          4. 8.3.2.2.4 Low-Noise LDO (LDO4)
      3. 8.3.3  Output Voltage Monitor and PGOOD Generation
      4. 8.3.4  Thermal Monitoring
        1. 8.3.4.1 Thermal Warning Function
        2. 8.3.4.2 Thermal Shutdown
      5. 8.3.5  Backup Supply Power-Path
      6. 8.3.6  General-Purpose I/Os (GPIO Pins)
      7. 8.3.7  nINT, EN_DRV, and nRSTOUT Pins
      8. 8.3.8  Interrupts
      9. 8.3.9  RTC
        1. 8.3.9.1 General Description
        2. 8.3.9.2 Time Calendar Registers
          1. 8.3.9.2.1 TC Registers Read Access
          2. 8.3.9.2.2 TC Registers Write Access
        3. 8.3.9.3 RTC Alarm
        4. 8.3.9.4 RTC Interrupts
        5. 8.3.9.5 RTC 32-kHz Oscillator Drift Compensation
      10. 8.3.10 Watchdog (WDOG)
        1. 8.3.10.1 Watchdog Fail Counter and Status
        2. 8.3.10.2 Watchdog Start-Up and Configuration
        3. 8.3.10.3 MCU to Watchdog Synchronization
        4. 8.3.10.4 Watchdog Disable Function
        5. 8.3.10.5 Watchdog Sequence
        6. 8.3.10.6 Watchdog Trigger Mode
        7. 8.3.10.7 WatchDog Flow Chart and Timing Diagrams in Trigger Mode
        8.       79
        9. 8.3.10.8 Watchdog Question-Answer Mode
          1. 8.3.10.8.1 Watchdog Q&A Related Definitions
          2. 8.3.10.8.2 Question Generation
          3. 8.3.10.8.3 Answer Comparison
            1. 8.3.10.8.3.1 Sequence of the 2-bit Watchdog Answer Counter
            2. 8.3.10.8.3.2 Watchdog Sequence Events and Status Updates
            3. 8.3.10.8.3.3 Watchdog Q&A Sequence Scenarios
      11. 8.3.11 Error Signal Monitor (ESM)
        1. 8.3.11.1 ESM Error-Handling Procedure
          1. 8.3.11.1.1 Level Mode
          2.        90
          3. 8.3.11.1.2 PWM Mode
            1. 8.3.11.1.2.1 Good-Events and Bad-Events
            2. 8.3.11.1.2.2 ESM Error-Counter
            3. 8.3.11.1.2.3 ESM Start-Up in PWM Mode
            4. 8.3.11.1.2.4 ESM Flow Chart and Timing Diagrams in PWM Mode
            5.         96
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device State Machine
        1. 8.4.1.1 Fixed Device Power FSM
          1. 8.4.1.1.1 Register Resets and NVM Read at INIT State
        2. 8.4.1.2 Pre-Configurable Mission States
          1. 8.4.1.2.1 PFSM Commands
            1. 8.4.1.2.1.1  REG_WRITE_IMM Command
            2. 8.4.1.2.1.2  REG_WRITE_MASK_IMM Command
            3. 8.4.1.2.1.3  REG_WRITE_MASK_PAGE0_IMM Command
            4. 8.4.1.2.1.4  REG_WRITE_BIT_PAGE0_IMM Command
            5. 8.4.1.2.1.5  REG_WRITE_WIN_PAGE0_IMM Command
            6. 8.4.1.2.1.6  REG_WRITE_VOUT_IMM Command
            7. 8.4.1.2.1.7  REG_WRITE_VCTRL_IMM Command
            8. 8.4.1.2.1.8  REG_WRITE_MASK_SREG Command
            9. 8.4.1.2.1.9  SREG_READ_REG Command
            10. 8.4.1.2.1.10 SREG_WRITE_IMM Command
            11. 8.4.1.2.1.11 WAIT Command
            12. 8.4.1.2.1.12 DELAY_IMM Command
            13. 8.4.1.2.1.13 DELAY_SREG Command
            14. 8.4.1.2.1.14 TRIG_SET Command
            15. 8.4.1.2.1.15 TRIG_MASK Command
            16. 8.4.1.2.1.16 END Command
          2. 8.4.1.2.2 Configuration Memory Organization and Sequence Execution
          3. 8.4.1.2.3 Mission State Configuration
          4. 8.4.1.2.4 Pre-Configured Hardware Transitions
            1. 8.4.1.2.4.1 ON Requests
            2. 8.4.1.2.4.2 OFF Requests
            3. 8.4.1.2.4.3 NSLEEP1 and NSLEEP2 Functions
            4. 8.4.1.2.4.4 WKUP1 and WKUP2 Functions
            5. 8.4.1.2.4.5 LP_WKUP Pins for Waking Up from LP STANDBY
        3. 8.4.1.3 Error Handling Operations
          1. 8.4.1.3.1 Power Rail Output Error
          2. 8.4.1.3.2 Catastrophic Error
          3. 8.4.1.3.3 Watchdog (WDOG) Error
          4. 8.4.1.3.4 Warnings
        4. 8.4.1.4 Device Start-up Timing
        5. 8.4.1.5 Power Sequences
        6. 8.4.1.6 First Supply Detection
        7. 8.4.1.7 Register Power Domains and Reset Levels
      2. 8.4.2 Multi-PMIC Synchronization
        1. 8.4.2.1 SPMI Interface System Setup
        2. 8.4.2.2 Transmission Protocol and CRC
          1. 8.4.2.2.1 Operation with Transmission Errors
          2. 8.4.2.2.2 Transmitted Information
        3. 8.4.2.3 SPMI Target Device Communication to SPMI Controller Device
          1. 8.4.2.3.1 Incomplete Communication from SPMI Target Device to SPMI Controller Device
        4. 8.4.2.4 SPMI-BIST Overview
          1. 8.4.2.4.1 SPMI Bus during Boot BIST and RUNTIME BIST
          2. 8.4.2.4.2 Periodic Checking of the SPMI
          3. 8.4.2.4.3 SPMI Message Priorities
    5. 8.5 Control Interfaces
      1. 8.5.1 CRC Calculation for I2C and SPI Interface Protocols
      2. 8.5.2 I2C-Compatible Interface
        1. 8.5.2.1 数据有效性
        2. 8.5.2.2 启动和停止条件
        3. 8.5.2.3 Transferring Data
        4. 8.5.2.4 Auto-Increment Feature
      3. 8.5.3 Serial Peripheral Interface (SPI)
    6. 8.6 Configurable Registers
      1. 8.6.1 Register Page Partitioning
      2. 8.6.2 CRC Protection for Configuration, Control, and Test Registers
      3. 8.6.3 CRC Protection for User Registers
      4. 8.6.4 Register Write Protection
        1. 8.6.4.1 Watchdog and ESM Configuration Registers
        2. 8.6.4.2 User Registers
    7. 8.7 Register Maps
      1. 8.7.1 TPS6593-Q1 Registers
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Powering a Processor
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 VCCA
          2. 9.2.1.2.2 Internal LDOs
          3. 9.2.1.2.3 Crystal Oscillator
          4. 9.2.1.2.4 Buck Input Capacitors
          5. 9.2.1.2.5 Buck Output Capacitors
          6. 9.2.1.2.6 Buck Inductors
          7. 9.2.1.2.7 LDO Input Capacitors
          8. 9.2.1.2.8 LDO Output Capacitors
          9. 9.2.1.2.9 Digital Signal Connections
      2. 9.2.2 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 10.2 Device Nomenclature
    3. 10.3 Documentation Support
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 支持资源
    6. 10.6 Trademarks
    7. 10.7 静电放电警告
    8. 10.8 术语表
  12. 11Mechanical, Packaging, and Orderable Information

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General-Purpose I/Os (GPIO Pins)

The TPS6593-Q1 device integrates eleven configurable general-purpose I/Os that are multiplexed with alternative features as listed in Section 6

For GPIOs characteristics, refer to Electrical Characteristics tables for Digital Input Signal Parameters and Digital Output Signal Parameters.

When configured as primary functions, all GPIOs are controlled through the following set of registers bits under the individual GPIOn_CONF register.

  • GPIOn_DEGLITCH_EN: Enables the 8 µs deglitch time for each GPIO pin (input)
  • GPIOn_PU_PD_EN: Enables the internal pull up or pull down resistor connected to each GPIO pin
  • GPIOn_PU_SEL: Selects the pull up or the pull down resistor to be connected when GPIOn_PU_PD_EN = '1'. '1' = pull-up resistor selected, '0' = pull-down resistor selected
  • GPIOn_OD: Configures the GPIO pin (output) as: '1' = open drain, '0' = push-pull
  • GPIOn_DIR: Configures the input or output direction of each GPIO pin

Each GPIO event can generate an interrupt on a rising edge, falling edge, or both, configured through the GPIOn_FALL_MASK and the GPIOn_RISE_MASK register bits. A GPIO-interrupt applies when the primary function (general-purpose I/O) has been selected and also for the following alternative functions:

  • nRSTOUT_SOC
  • PGOOD
  • nERR_MCU
  • nERR_SoC
  • TRIG_WDOG
  • DISABLE_WDOG
  • NSLEEP1, NSLEEP2
  • WKUP1, WKUP2
  • LP_WKUP1, LP_WKUP2

The GPIOn_SEL[2:0] register bits under the GPIOn_CONF registers control the selection between a primary and an alternative function. When a pre-defined function is selected, some predetermined IO characteristics (such as pullup, pulldown, push-pull or open drain) for the pin are enforced regardless of the settings of the associated GPIO configuration register. Please note that if the GPIOn_SEL[2:0] is changed during device operation, a signal glitch may occur which may cause digital malfunction, especially if it involves a clock signal such as SCL_I2C2, CLK32KOUT, SCL_SPMI, SYNCCLKIN, or SYNCCLKOUT. Please refer to Section 6.1 for more detail on the predetermined IO characteristics for each pre-defined digital interface function.

All GPIOs can be configured as a wake-up input when it is configured as a WKUP1 or a WKUP2 signal. Only GPIO3 and GPIO4 can be configured as LP_WKUP1 or LP_WKUP2 signal so that they can be used to wake-up the device from LP_STANDBY state. All GPIOs can also be configured as a NSLEEP1 or a NSLEEP2 input. For more information regarding the usage of the NSLEEPx pins and the WKUPx pins, please refer to Section 8.4.1.2.4.3 and Section 8.4.1.2.4.4.

Any of the GPIO pin can also be configured as part of the power-up sequence to enable external devices such as external BUCKs when it is configured as a general-purpose output port.

The nINT pin, the EN_DRV pin, the nRSTOUT pin and the GPIO pin assigned as nRSTOUT_SOC have readback monitoring to detect errors on the signals. The monitoring of the EN_DRV pin checks for mismatch in both low and high levels. For the nINT pin, the nRSTOUT pin and the GPIO pin assigned as nRSTOUT_SOC, the readback monitoring only checks for mismatches in the low level, therefore it is allowed to combine these signals with other external pull-down sources. The readback mismatch is continuously monitored without deglitch circuitry during operation, and the monitoring is gated for tgate_readback period when the signal state is changed or when a new function is selected for the GPIO pin with the GPIOn_SEL bits. NINT_READBACK_INT, EN_DRV_READBACK_INT, NRSTOUT_READBACK_INT, and NRSTOUT_SOC_READBACK_INT are the interrupt bits that are set in an event of a readback mismatch for these pins, respectively.

Note: All GPIO pin are set to generic input pins with resistive pull-down before NVM memory is loaded during device power up. Therefore, if any GPIOs has external pull-up resistors connecting to a voltage domain that is energized before the NVM memory is loaded, the GPIO pin is pulled high before the configuration for the pin is loaded from the NVM.
Note: For GPIO pins with internal pull down enabled, additional leakage current flows into the GPIO pin if this pin is pulled-up to a voltage higher than the voltage level of its output power domain. If the internal pull down must be enabled, please use a resistor divider to divide down the input voltage, or use a series resistor to connect to the input source and ensure the voltage level at the GPIO pin is below the voltage level of its output power domain.