ZHCSFF4C
February 2016 – August 2021
TPS65981
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
说明(续)
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Power Supply Requirements and Characteristics
7.6
Power Supervisor Characteristics
7.7
Power Consumption Characteristics
7.8
Cable Detection Characteristics
7.9
USB-PD Baseband Signal Requirements and Characteristics
7.10
USB-PD TX Driver Voltage Adjustment Parameter
7.11
Port Power Switch Characteristics
7.12
Port Data Multiplexer Switching Characteristics
7.13
Port Data Multiplexer Clamp Characteristics
7.14
Port Data Multiplexer SBU Detection Requirements
7.15
Port Data Multiplexer Signal Monitoring Pullup and Pulldown Characteristics
7.16
Port Data Multiplexer USB Endpoint Requirements and Characteristics
7.17
Port Data Multiplexer BC1.2 Detection Requirements and Characteristics
7.18
Analog-to-Digital Converter (ADC) Characteristics
7.19
Input-Output (I/O) Requirements and Characteristics
7.20
I2C Slave Requirements and Characteristics
7.21
SPI Controller Characteristics
7.22
BUSPOWERZ Configuration Requirements
7.23
Single-Wire Debugger (SWD) Timing Requirements
7.24
Thermal Shutdown Characteristics
7.25
HPD Timing Requirements and Characteristics
7.26
Oscillator Requirements and Characteristics
7.27
Typical Characteristics
8
Parameter Measurement Information
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
USB-PD Physical Layer
9.3.1.1
USB-PD Encoding and Signaling
9.3.1.2
USB-PD Bi-Phase Marked Coding
9.3.1.3
USB-PD Transmit (TX) and Receive (Rx) Masks
9.3.1.4
USB-PD BMC Transmitter
9.3.1.5
USB-PD BMC Receiver
9.3.2
Cable Plug and Orientation Detection
9.3.2.1
Configured as a DFP
9.3.2.2
Configured as a UFP
9.3.2.3
Dead-Battery or No-Battery Support
9.3.3
Port Power Switches
9.3.3.1
5-V Power Delivery
9.3.3.2
5V Power Switch as a Source
9.3.3.3
PP_5V0 Current Sense
9.3.3.4
PP_5V0 Current Limit
9.3.3.5
Internal HV Power Delivery
9.3.3.6
Internal HV Power Switch as a Source
9.3.3.7
Internal HV Power Switch as a Sink
9.3.3.8
Internal HV Power Switch Current Sense
9.3.3.9
Internal HV Power Switch Current Limit
9.3.3.10
External HV Power Delivery
9.3.3.11
External HV Power Switch as a Source with RSENSE
9.3.3.12
External HV Power Switch as a Sink With RSENSE
9.3.3.13
External HV Power Switch as a Sink Without RSENSE
9.3.3.14
External Current Sense
9.3.3.15
External Current Limit
9.3.3.16
Soft Start
9.3.3.17
BUSPOWERZ
9.3.3.18
Voltage Transitions on VBUS through Port Power Switches
9.3.3.19
HV Transition to PP_RV0 Pull-down on VBUS
9.3.3.20
VBUS Transition to VSAFE0V
9.3.3.21
C_CC1 and C_CC2 Power Configuration and Power Delivery
9.3.3.22
PP_CABLE to C_CC1 and C_CC2 Switch Architecture
9.3.3.23
PP_CABLE to C_CC1 and C_CC2 Current Limit
9.3.4
USB Type-C® Port Data Multiplexer
9.3.4.1
USB Top and Bottom Ports
9.3.4.2
Multiplexer Connection Orientation
9.3.4.3
SBU Crossbar Multiplexer
9.3.4.4
Signal Monitoring and Pull-up and Pull-down
9.3.4.5
Port Multiplexer Clamp
9.3.4.6
USB2.0 Low-Speed Endpoint
9.3.4.7
Battery Charger (BC1.2) Detection Block
9.3.4.8
BC1.2 Data Contact Detect
9.3.4.9
BC1.2 Primary and Secondary Detection
9.3.5
Power Management
9.3.5.1
Power-On and Supervisory Functions
9.3.5.2
Supply Switch-Over
9.3.5.3
RESETZ and MRESET
9.3.6
Digital Core
9.3.7
USB-PD BMC Modem Interface
9.3.8
System Glue Logic
9.3.9
Power Reset Congrol Module (PRCM)
9.3.10
Interrupt Monitor
9.3.11
ADC Sense
9.3.12
I2C Slave
9.3.13
SPI Controller
9.3.14
Single-Wire Debugger Interface
9.3.15
DisplayPort HPD Timers
9.3.16
ADC
9.3.16.1
ADC Divider Ratios
9.3.16.2
ADC Operating Modes
9.3.16.3
Single Channel Readout
9.3.16.4
Round-Robin Automatic Readout
9.3.16.5
One Time Automatic Readout
9.3.17
I/O Buffers
9.3.17.1
IOBUF_GPIOLS and IOBUF_GPIOLSI2C
9.3.17.2
IOBUF_OD
9.3.17.3
IOBUF_PORT
9.3.17.4
IOBUF_I2C
9.3.17.5
IOBUF_GPIOHSPI
9.3.17.6
IOBUF_GPIOHSSWD
9.3.18
Thermal Shutdown
9.3.19
Oscillators
9.4
Device Functional Modes
9.4.1
Boot Code
9.4.2
Initialization
9.4.3
I2C Configuration
9.4.4
Dead-Battery Condition
9.4.5
Application Code
9.4.6
Flash Memory Read
9.4.7
Invalid Flash Memory
9.5
Programming
9.5.1
SPI Controller Interface
9.5.2
I2C Slave Interface
9.5.2.1
I2C Interface Description
9.5.2.2
I2C Clock Stretching
9.5.2.3
I2C Address Setting
9.5.2.4
Unique Address Interface
9.5.2.5
I2C Pin Address Setting
10
Application and Implementation
10.1
Application Information
10.2
Typical Applications
10.2.1
Fully-Featured USB Type-C® and PD Charger Application
10.2.1.1
Design Requirements
10.2.1.1.1
External FET Path Components (PP_EXT and RSENSE)
10.2.1.2
Detailed Design Procedure
10.2.1.2.1
TPS65981 External Flash
10.2.1.2.2
Debug Control (DEBUG_CTL) and I2C (I2C) Resistors
10.2.1.2.3
Oscillator (R_OSC) Resistor
10.2.1.2.4
VBUS Capacitor and Ferrite Bead
10.2.1.2.5
Soft Start (SS) Capacitor
10.2.1.2.6
USB Top (C_USB_T), USB Bottom (C_USB_B), and Sideband-Use (SBU) Connections
10.2.1.2.7
Port Power Switch (PP_EXT, PP_HV, PP_5V0, and PP_CABLE) Capacitors
10.2.1.2.8
Cable Connection (CCn) Capacitors and RPD_Gn Connections
10.2.1.2.9
LDO_3V3, LDO_1V8A, LDO_1V8D, LDO_BMC, VIN_3V3, and VDDIO
10.2.1.3
Application Curve
10.2.2
USB Type-C® and PD Dock or Monitor Application
10.2.2.1
Design Requirements
10.2.2.2
Detailed Design Procedure
10.2.2.2.1
Port Power Switch (PP_5V0 and PP_CABLE) Capacitors
10.2.2.2.2
HD3SS460 Control and DisplayPort Configuration
10.2.2.2.3
AC-DC Power Supply (Barrel Jack) Detection Circuitry
10.2.2.2.4
TPS65981 Control of Variable Buck Regulator Output Voltage (PP_HV)
10.2.2.2.5
TPS65981 and System Controller Interaction
10.2.2.3
Application Curves
11
Power Supply Recommendations
11.1
3.3 V Power
11.1.1
VIN_3V3 Input Switch
11.1.2
VBUS 3.3-V LDO
11.2
1.8 V Core Power
11.2.1
1.8 V Digital LDO
11.2.2
1.8 V Analog LDO
11.3
VDDIO
11.3.1
Recommended Supply Load Capacitance
11.3.2
Schottky for Current Surge Protection
12
Layout
12.1
Layout Guidelines
12.1.1
TPS65981 Recommended Footprint
12.1.2
Top TPS65981 Placement and Bottom Component Placement and Layout
12.1.3
Component Placement
12.1.4
Designs Rules and Guidance
12.1.5
Routing PP_HV, PP_EXT, PP_5V0, and VBUS
12.1.6
Routing Top and Bottom Passive Components
12.1.7
Thermal Pad Via Placement
12.1.8
Top Layer Routing
12.1.9
Inner Signal Layer Routing
12.1.10
Bottom Layer Routing
12.2
Layout Example
13
Device and Documentation Support
13.1
Device Support
13.1.1
Development Support
13.2
Documentation Support
13.2.1
Related Documentation
13.3
接收文档更新通知
13.4
支持资源
13.5
Trademarks
13.6
Electrostatic Discharge Caution
13.7
术语表
14
Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
RTQ|56
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsff4c_oa
zhcsff4c_pm
13
Device and Documentation Support
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP
|
米乐app下载官网(中国)|ios|Android/通用版APP最新版
|
米乐|米乐·M6(中国大陆)官方网站
|
千亿体育登陆地址
|
华体会体育(中国)HTH·官方网站
|
千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载
|
18新利网v1.2.5|中国官方网站
|
bob电竞真人(中国官网)安卓/ios苹果/电脑版【1.97.95版下载】
|
千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装
|