The oval pad footprint layout is generally more difficult to route than the standard footprint due to the top layer fan-out and void via placement needed; however, when the footprint with oval pads is used, “Via on Pads,” laser-drilled vias, and HDI board processes are not required. Therefore, a footprint with oval pads is ideal for cost-optimized applications and will be used for the following the layout example. This layout example follows the charger application example (see Typical Application) and includes all necessary passive components needed for this application. This design uses both the internal and optional external FET paths for sourcing and sinking power respectively. Follow the differential impedances for High Speed signals defined by their specifications (DisplayPort - AUXN/P and USB2.0). All I/O will be fanned out to provide an example for routing out all pins, not all designs will use all of the I/O on the TPS65983B.