Placement of components on the top and bottom layers is used for this example to minimize solution size. The TPS65983B is placed on the top layer of the board and the majority of its components are placed on the bottom layer. When placing the components on the bottom layer, TI recommends placing components directly under the TPS65983B in a manner where the pads of the components are not directly under the void on the top layer. Figure 12-6 and Figure 12-7 show the placement in 2-D. Figure 12-8 and Figure 12-9 show the placement in 3-D.