ZHCSFL8C October   2016  – August 2021 TPS65983B

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Supply Requirements and Characteristics
    6. 7.6  Power Supervisor Characteristics
    7. 7.7  Power Consumption Characteristics
    8. 7.8  Cable Detection Characteristics
    9. 7.9  USB-PD Baseband Signal Requirements and Characteristics
    10. 7.10 USB-PD TX Driver Voltage Adjustment Parameter (1)
    11. 7.11 Port Power Switch Characteristics
    12. 7.12 Port Data Multiplexer Switching and Timing Characteristics
    13. 7.13 Port Data Multiplexer Clamp Characteristics
    14. 7.14 Port Data Multiplexer SBU Detection Requirements
    15. 7.15 Port Data Multiplexer Signal Monitoring Pullup and Pulldown Characteristics
    16. 7.16 Port Data Multiplexer USB Endpoint Requirements and Characteristics
    17. 7.17 Port Data Multiplexer BC1.2 Detection Requirements and Characteristics
    18. 7.18 Analog-to-Digital Converter (ADC) Characteristics
    19. 7.19 Input/Output (I/O) Requirements and Characteristics
    20. 7.20 I2C Slave Requirements and Characteristics
    21. 7.21 SPI Controller Characteristics
    22. 7.22 Single-Wire Debugger (SWD) Timing Requirements
    23. 7.23 BUSPOWERZ Configuration Requirements
    24. 7.24 HPD Timing Requirements and Characteristics
    25. 7.25 Thermal Shutdown Characteristics
    26. 7.26 Oscillator Requirements and Characteristics
    27. 7.27 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  USB-PD Physical Layer
        1. 9.3.1.1 USB-PD Encoding and Signaling
        2. 9.3.1.2 USB-PD Bi-Phase Marked Coding
        3. 9.3.1.3 USB-PD Transmit (TX) and Receive (Rx) Masks
        4. 9.3.1.4 USB-PD BMC Transmitter
        5. 9.3.1.5 USB-PD BMC Receiver
      2. 9.3.2  Cable Plug and Orientation Detection
        1. 9.3.2.1 Configured as a DFP
        2. 9.3.2.2 Configured as a UFP
        3. 9.3.2.3 Fast Role Swap Signaling
        4. 9.3.2.4 Dead-Battery or No-Battery Support
      3. 9.3.3  Port Power Switches
        1. 9.3.3.1  5V Power Delivery
        2. 9.3.3.2  5V Power Switch as a Source
        3. 9.3.3.3  PP_5V0 Current Sense
        4. 9.3.3.4  PP_5V0 Current Limit
        5. 9.3.3.5  Internal HV Power Delivery
        6. 9.3.3.6  Internal HV Power Switch as a Source
        7. 9.3.3.7  Internal HV Power Switch as a Sink
        8. 9.3.3.8  Internal HV Power Switch Current Sense
        9. 9.3.3.9  Internal HV Power Switch Current Limit
        10. 9.3.3.10 External HV Power Delivery
        11. 9.3.3.11 External HV Power Switch as a Source with RSENSE
        12. 9.3.3.12 External HV Power Switch as a Sink with RSENSE
        13. 9.3.3.13 External HV Power Switch as a Sink without RSENSE
        14. 9.3.3.14 External Current Sense
        15. 9.3.3.15 External Current Limit
        16. 9.3.3.16 Soft Start
        17. 9.3.3.17 BUSPOWERZ
        18. 9.3.3.18 Voltage Transitions on VBUS through Port Power Switches
        19. 9.3.3.19 HV Transition to PP_RV0 Pull-Down on VBUS
        20. 9.3.3.20 VBUS Transition to VSAVE0V
        21. 9.3.3.21 C_CC1 and C_CC2 Power Configuration and Power Delivery
        22. 9.3.3.22 PP_CABLE to C_CC1 and C_CC2 Switch Architecture
        23. 9.3.3.23 PP_CABLE to C_CC1 and C_CC2 Current Limit
      4. 9.3.4  USB Type-C Port Data Multiplexer
        1. 9.3.4.1  USB Top and Bottom Ports
        2. 9.3.4.2  Multiplexer Connection Orientation
        3. 9.3.4.3  Digital Crossbar Multiplexer
        4. 9.3.4.4  SBU Crossbar Multiplexer
        5. 9.3.4.5  Signal Monitoring and Pullup and Pulldown
        6. 9.3.4.6  Port Multiplexer Clamp
        7. 9.3.4.7  USB2.0 Low-Speed Endpoint
        8. 9.3.4.8  Battery Charger (BC1.2) Detection Block
        9. 9.3.4.9  BC1.2 Data Contact Detect
        10. 9.3.4.10 BC1.2 Primary and Secondary Detection
      5. 9.3.5  Power Management
        1. 9.3.5.1 Power-On and Supervisory Functions
        2. 9.3.5.2 Supply Switch-Over
        3. 9.3.5.3 RESETZ and MRESET
      6. 9.3.6  Digital Core
      7. 9.3.7  USB-PD BMC Modem Interface
      8. 9.3.8  System Glue Logic
      9. 9.3.9  Power Reset Congrol Module (PRCM)
      10. 9.3.10 Interrupt Monitor
      11. 9.3.11 ADC Sense
      12. 9.3.12 UART
      13. 9.3.13 I2C Slave
      14. 9.3.14 SPI Controller
      15. 9.3.15 Single-Wire Debugger Interface
      16. 9.3.16 DisplayPort HPD Timers
      17. 9.3.17 ADC
        1. 9.3.17.1 ADC Divider Ratios
        2. 9.3.17.2 ADC Operating Modes
        3. 9.3.17.3 Single Channel Readout
        4. 9.3.17.4 Round Robin Automatic Readout
        5. 9.3.17.5 One Time Automatic Readout
      18. 9.3.18 I/O Buffers
        1. 9.3.18.1 IOBUF_GPIOLS and IOBUF_GPIOLSI2C
        2. 9.3.18.2 IOBUF_OD
        3. 9.3.18.3 IOBUF_UTX
        4. 9.3.18.4 IOBUF_URX
        5. 9.3.18.5 IOBUF_PORT
        6. 9.3.18.6 IOBUF_I2C
        7. 9.3.18.7 IOBUF_GPIOHSPI
        8. 9.3.18.8 IOBUF_GPIOHSSWD
      19. 9.3.19 Thermal Shutdown
      20. 9.3.20 Oscillators
    4. 9.4 Device Functional Modes
      1. 9.4.1 Boot Code
      2. 9.4.2 Initialization
      3. 9.4.3 I2C Configuration
      4. 9.4.4 Dead-Battery Condition
      5. 9.4.5 Application Code
      6. 9.4.6 Flash Memory Read
      7. 9.4.7 Invalid Flash Memory
      8. 9.4.8 UART Download
        1. 9.4.8.1 Primary TPS65983B Flash Master and Secondary Port
    5. 9.5 Programming
      1. 9.5.1 SPI Controller Interface
      2. 9.5.2 I2C Slave Interface
        1. 9.5.2.1 I2C Interface Description
        2. 9.5.2.2 I2C Clock Stretching
        3. 9.5.2.3 I2C Address Setting
        4. 9.5.2.4 Unique Address Interface
        5. 9.5.2.5 I2C Pin Address Setting
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Fully-Featured USB Type-C and PD Charger Application
        1. 10.2.1.1 Design Requirements
          1. 10.2.1.1.1 External FET Path Components (PP_EXT and RSENSE)
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 TPS65983B External Flash
          2. 10.2.1.2.2 I2C (I2C), Debug Control (DEBUG_CTL), and Single-Wire De-bugger (SWD) Resistors
          3. 10.2.1.2.3 Oscillator (R_OSC) Resistor
          4. 10.2.1.2.4 VBUS Capacitor and Ferrite Bead
          5. 10.2.1.2.5 Soft Start (SS) Capacitor
          6. 10.2.1.2.6 USB Top (C_USB_T), USB Bottom (C_USB_B), and Sideband-Use (SBU) Connections
          7. 10.2.1.2.7 Port Power Switch (PP_EXT, PP_HV, PP_5V0, and PP_CABLE) Capacitors
          8. 10.2.1.2.8 Cable Connection (CCn) Capacitors and RPD_Gn Connections
          9. 10.2.1.2.9 LDO_3V3, LDO_1V8A, LDO_1V8D, LDO_BMC, VOUT_3V3, VIN_3V3, and VDDIO
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Dual-Port Notebook Application Supporting USB PD Charging and DisplayPort
        1. 10.2.2.1 Design Requirements
          1. 10.2.2.1.1 Source Power Delivery Profiles for Type-C Ports
          2. 10.2.2.1.2 Sink Power Delivery Profile for Type-C Ports
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 TPS65983B and System Controller Interaction
          2. 10.2.2.2.2 HD3SS460 Control and DisplayPort Configuration
          3. 10.2.2.2.3 9.3.2.3 DC Barrel Jack and Type-C PD Charging
          4. 10.2.2.2.4 TPS65983B Dead Battery Support Primary and Secondary Port
          5. 10.2.2.2.5 Debugging Methods
        3. 10.2.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 3.3 V Power
      1. 11.1.1 1VIN_3V3 Input Switch
      2. 11.1.2 VOUT_3V3 Output Switch
      3. 11.1.3 VBUS 3.3 V LDO
    2. 11.2 1.8 V Core Power
      1. 11.2.1 1.8 V Digital LDO
      2. 11.2.2 1.8 V Analog LDO
    3. 11.3 VDDIO
      1. 11.3.1 Recommended Supply Load Capacitance
      2. 11.3.2 Schottky for Current Surge Protection
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1  TPS65983B Recommended Footprints
        1. 12.1.1.1 Standard TPS65983B Footprint (Circular Pads)
      2. 12.1.2  Alternate TPS65983B Footprint (Oval Pads)
      3. 12.1.3  Top TPS65983B Placement and Bottom Component Placement and Layout
      4. 12.1.4  Oval Pad Footprint Layout and Placement
      5. 12.1.5  Component Placement
      6. 12.1.6  Designs Rules and Guidance
      7. 12.1.7  Routing PP_HV, PP_EXT, PP_5V0, and VBUS
      8. 12.1.8  Routing Top and Bottom Passive Components
      9. 12.1.9  Void Via Placement
      10. 12.1.10 Top Layer Routing
      11. 12.1.11 Inner Signal Layer Routing
      12. 12.1.12 Bottom Layer Routing
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 接收文档更新通知
    4. 13.4 支持资源
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 术语表
  14. 14Mechanical, Packaging, and Orderable Information

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7.5 Power Supply Requirements and Characteristics

Recommended operating conditions; TA = –10 to +85°C unless otherwise noted
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
EXTERNAL
VIN_3V3Input 3.3-V supply2.853.33.45V
PP_CABLEInput voltage to power C_CC pins. This input is also available to power core circuitry and the VOUT_3V3 output.2.9555.5V
VBUSBi-direction DC bus voltage. Output from the TPS65983B or input to the TPS65983B.4522V
PP_5V05-V supply input to power VBUS. This supply does not power the TPS65983B.4.7555.5V
VDDIO(1)Optional supply for I/O cells.1.73.45V
INTERNAL
VLDO_3V3DC 3.3V generated internally by either a switch from VIN_3V3, an LDO from PP_CABLE, or an LDO from VBUS2.73.33.45V
VDO_LDO3V3Drop Out Voltage of LDO_3V3 from PP_CABLEILOAD = 50 mA250mV
Drop Out Voltage of LDO_3V3 from VBUS250500750mV
VLDO_1V8DDC 1.8V generated for internal digital circuitry.1.71.81.9V
VLDO_1V8ADC 1.8V generated for internal analog circuitry.1.71.81.9V
VLDO_BMCDC voltage generated on LDO_BMC. Setting for USB-PD.1.051.1251.2V
ILDO_3V3DC current supplied by the 3.3V LDOs. This includes internal core power and external load on LDO_3V3.70mA
ILDO_3V3EXExternal DC current supplied by LDO_3V330mA
IOUT_3V3External DC current supplied by VOUT_3V3100mA
ILDO_1V8DDC current supplied by LDO_1V8D. This is intended for internal loads only but small external loads may be added.50mA
ILDO_1V8DEXExternal DC current supplied by LDO_1V8D.5mA
ILDO_1V8ADC current supplied by LDO_1V8A. This is intended for internal loads only but small external loads may be added.20mA
ILDO_1V8AEXExternal DC current supplied by LDO_1V8A.5mA
ILDO_BMCDC current supplied by LDO_BMC. This is intended for internal loads only.5mA
ILDO_BMCEXExternal DC current supplied by LDO_BMC.0mA
VFWD_DROPForward voltage drop across VIN_3V3 to LDO_3V3 switchILOAD = 50 mA256090mV
RIN_3V3Input switch resistance from VIN_3V3 to LDO_3V3VVIN_3V3 – VLDO_3V3 > 50 mV0.51.11.75Ω
ROUT_3V3Output switch resistance from VIN_3V3 to VOUT_3V30.350.7Ω
TR_OUT3V310-90% rise time on VOUT_3V3 from switch enable.CVOUT_3V3 = 1 μF35120µs
(1) I/O buffers are not fail-safe to LDO_3V3. Therefore, VDDIO may power-up before LDO_3V3. When VDDIO powers up before LDO_3V3, the I/Os shall not be driven high. When VDDIO is low and LDO_3V3 is high, the I/Os may be driven high.
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