ZHCSJP1B May   2019  – October 2022 TPS65987DDJ

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Supply Requirements and Characteristics
    6. 6.6  Power Consumption Characteristics
    7. 6.7  Power Switch Characteristics
    8. 6.8  Cable Detection Characteristics
    9. 6.9  USB-PD Baseband Signal Requirements and Characteristics
    10. 6.10 BC1.2 Characteristics
    11. 6.11 Thermal Shutdown Characteristics
    12. 6.12 Oscillator Characteristics
    13. 6.13 I/O Characteristics
    14. 6.14 I2C Requirements and Characteristics
    15. 6.15 SPI Controller Timing Requirements
    16. 6.16 HPD Timing Requirements
    17. 6.17 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  USB-PD Physical Layer
        1. 8.3.1.1 USB-PD Encoding and Signaling
        2. 8.3.1.2 USB-PD Bi-Phase Marked Coding
        3. 8.3.1.3 USB-PD Transmit (TX) and Receive (Rx) Masks
        4. 8.3.1.4 USB-PD BMC Transmitter
        5. 8.3.1.5 USB-PD BMC Receiver
      2. 8.3.2  Power Management
        1. 8.3.2.1 Power-On And Supervisory Functions
        2. 8.3.2.2 VBUS LDO
        3. 8.3.2.3 Supply Switch Over
      3. 8.3.3  Port Power Switches
        1. 8.3.3.1 PP_HV Power Switch
          1. 8.3.3.1.1 PP_HV Overcurrent Clamp
          2. 8.3.3.1.2 PP_HV Overcurrent Protection
          3. 8.3.3.1.3 PP_HV OVP and UVP
          4. 8.3.3.1.4 PP_HV Reverse Current Protection
        2. 8.3.3.2 Schottky for Current Surge Protection
        3. 8.3.3.3 PP_EXT Power Path Control
        4. 8.3.3.4 PP_CABLE Power Switch
          1. 8.3.3.4.1 PP_CABLE Overcurrent Protection
          2. 8.3.3.4.2 PP_CABLE Input Good Monitor
        5. 8.3.3.5 VBUS Transition to VSAFE5V
        6. 8.3.3.6 VBUS Transition to VSAFE0V
      4. 8.3.4  Cable Plug and Orientation Detection
        1. 8.3.4.1 Configured as a DFP
        2. 8.3.4.2 Configured as a UFP
        3. 8.3.4.3 Configured as a DRP
        4. 8.3.4.4 Fast Role Swap Signaling
      5. 8.3.5  Dead Battery Operation
        1. 8.3.5.1 Dead Battery Advertisement
        2. 8.3.5.2 BUSPOWER (ADCIN1)
      6. 8.3.6  Battery Charger Detection and Advertisement
        1. 8.3.6.1 BC1.2 Data Contact Detect
        2. 8.3.6.2 BC1.2 Primary and Secondary Detection
        3. 8.3.6.3 Charging Downstream Port Advertisement
        4. 8.3.6.4 Dedicated Charging Port Advertisement
        5. 8.3.6.5 2.7-V Divider3 Mode Advertisement
        6. 8.3.6.6 1.2-V Mode Advertisement
        7. 8.3.6.7 DCP Auto Mode Advertisement
      7. 8.3.7  ADC
      8. 8.3.8  DisplayPort HPD
      9. 8.3.9  Digital Interfaces
        1. 8.3.9.1 General GPIO
        2. 8.3.9.2 I2C
        3. 8.3.9.3 SPI
      10. 8.3.10 Digital Core
      11. 8.3.11 I2C Interfaces
        1. 8.3.11.1 I2C Interface Description
        2. 8.3.11.2 I2C Clock Stretching
        3. 8.3.11.3 I2C Address Setting
        4. 8.3.11.4 Unique Address Interface
        5. 8.3.11.5 I2C Pin Address Setting (ADCIN2)
      12. 8.3.12 SPI Controller Interface
      13. 8.3.13 Thermal Shutdown
      14. 8.3.14 Oscillators
    4. 8.4 Device Functional Modes
      1. 8.4.1 Boot
      2. 8.4.2 Power States
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Type-C VBUS Design Considerations
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Type-C Connector VBUS Capacitors
          2. 9.2.1.2.2 VBUS Schottky and TVS Diodes
          3. 9.2.1.2.3 VBUS Snubber Circuit
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Notebook Design Supporting PD Charging
        1. 9.2.2.1 USB and DisplayPort Notebook Supporting PD Charging
          1. 9.2.2.1.1 Design Requirements
          2. 9.2.2.1.2 Detailed Design Procedure
            1. 9.2.2.1.2.1 USB Power Delivery Source Capabilities
            2. 9.2.2.1.2.2 USB Power Delivery Sink Capabilities
            3. 9.2.2.1.2.3 f
            4. 9.2.2.1.2.4 TUSB1046 Super Speed Mux GPIO Control
        2. 9.2.2.2 Thunderbolt Notebook Supporting PD Charging
          1. 9.2.2.2.1 Design Requirements
          2. 9.2.2.2.2 Detailed Design Procedure
            1. 9.2.2.2.2.1 USB Power Delivery Source Capabilities
            2. 9.2.2.2.2.2 USB Power Delivery Sink Capabilities
            3. 9.2.2.2.2.3 Thunderbolt Supported Data Modes
            4. 9.2.2.2.2.4 RESETN
            5. 9.2.2.2.2.5 I2C Design Requirements
            6. 9.2.2.2.2.6 TS3DS10224 SBU Mux for AUX and LSTX/RX
            7. 9.2.2.2.2.7 Thunderbolt Flash Options
        3. 9.2.2.3 USB and DisplayPort Dock with Bus-Powered and Self-Powered Support
          1. 9.2.2.3.1 Design Requirements
          2. 9.2.2.3.2 Detailed Design Procedure
            1. 9.2.2.3.2.1 USB Power Delivery Source Capabilities
            2. 9.2.2.3.2.2 USB Power Delivery Sink Capabilities
            3. 9.2.2.3.2.3 USB and DisplayPort Supported Data Modes
            4. 9.2.2.3.2.4 TUSB1064 Super Speed Mux GPIO Control
  10. 10Power Supply Recommendations
    1. 10.1 3.3-V Power
      1. 10.1.1 VIN_3V3 Input Switch
      2. 10.1.2 VBUS 3.3-V LDO
    2. 10.2 1.8-V Power
    3. 10.3 Recommended Supply Load Capacitance
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Top TPS65987DDJ Placement and Bottom Component Placement and Layout
    2. 11.2 Layout Example
    3. 11.3 Component Placement
    4. 11.4 Routing PP_HV1/2, VBUS, PP_CABLE, VIN_3V3, LDO_3V3, LDO_1V8
    5. 11.5 Routing CC and GPIO
    6. 11.6 Thermal Dissipation for FET Drain Pads
    7. 11.7 USB2 Recommended Routing For BC1.2 Detection/Advertisement
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 12.1.2 Firmware Warranty Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 术语表
  13. 13Mechanical, Packaging, and Orderable Information

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6.9 USB-PD Baseband Signal Requirements and Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
COMMON
PD_BITRATEPD data bit rate270300330Kbps
UI (2)Unit interval (1/PD_BITRATE)3.033.333.7µs
CCBLPLUG (1)Capacitance for a cable plug (each plug on a cable may have up to this value)25pF
ZCABLECable characteristic impedance3265Ω
CRECEIVER (3)Receiver capacitance. Capacitance looking into C_CCn pin when in receiver mode.100pF
TRANSMITTER
ZDRIVERTX output impedance. Source output impedance at the Nyquist frequency of USB2.0 low speed (750kHz) while the source is driving the C_CCn line.3375Ω
tRISERise time. 10 % to 90 % amplitude points, minimum is under an unloaded condition. Maximum set by TX mask.300ns
tFALLFall time. 90 % to 10 % amplitude points, minimum is under an unloaded condition. Maximum set by TX mask.300ns
VTXTransmit high voltage1.051.1251.2V
RECEIVER
VRXTRRx receive rising input threshold Port configured as Source840875910mV
VRXTRRx receive rising input threshold Port configured as Sink504525546mV
VRXTFRx receive falling input threshold Port configured as Sink240250260mV
VRXTFRx receive falling input threshold Port configured as Source576600624mV
NCOUNTNumber of transitions for signal detection (number to count to detect non-idle bus).3
TTRANWINTime window for detecting non-idle bus.1220µs
ZBMCRXReceiver input impedanceDoes not include pull-up or pulldown resistance from cable detect. Transmitter is Hi-Z.5MΩ
TRXFILTER (4)Rx bandwidth limiting filter. Time constant of a single pole filter to limit broadband noise ingression100ns
(1) The capacitance of the bulk cable is not included in the CCBLPLUG definition. It is modeled as a transmission line.
(2) UI denotes the time to transmit an unencoded data bit not the shortest high or low times on the wire after encoding with BMC. A single

data bit cell has duration of 1 UI, but a data bit cell with value 1 will contain a centrally place 01 or 10 transition in addition to the

transition at the start of the cell.
(3) CRECEIVER includes only the internal capacitance on a C_CCn pin when the pin is configured to be receiving BMC data. External

capacitance is needed to meet the required minimum capacitance per the USB-PD Specifications. TI recommends adding capacitance

to bring the total pin capacitance to 300 pF for improved TX behavior.
(4) Broadband noise ingression is because of coupling in the cable interconnect.
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