ZHCSLZ8A September   2020  – August 2021 TPS65988DK

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Supply Requirements and Characteristics
    6. 6.6  Power Consumption Characteristics
    7. 6.7  Power Switch Characteristics
    8. 6.8  Cable Detection Characteristics
    9. 6.9  USB-PD Baseband Signal Requirements and Characteristics
    10. 6.10 Thermal Shutdown Characteristics
    11. 6.11 Oscillator Characteristics
    12. 6.12 I/O Characteristics
    13. 6.13 I2C Requirements and Characteristics
    14. 6.14 SPI Controller Timing Requirements
    15. 6.15 HPD Timing Requirements
    16. 6.16 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  USB-PD Physical Layer
        1. 8.3.1.1 USB-PD Encoding and Signaling
        2. 8.3.1.2 USB-PD Bi-Phase Marked Coding
        3. 8.3.1.3 USB-PD Transmit (TX) and Receive (Rx) Masks
        4. 8.3.1.4 USB-PD BMC Transmitter
        5. 8.3.1.5 USB-PD BMC Receiver
      2. 8.3.2  Power Management
        1. 8.3.2.1 Power-On and Supervisory Functions
        2. 8.3.2.2 VBUS LDO
        3. 8.3.2.3 Supply Switch Over
      3. 8.3.3  Port Power Switches
        1. 8.3.3.1 PP_HV Power Switch
          1. 8.3.3.1.1 PP_HV Overcurrent Clamp
          2. 8.3.3.1.2 PP_HV Overcurrent Protection
          3. 8.3.3.1.3 PP_HV OVP and UVP
          4. 8.3.3.1.4 PP_HV Reverse Current Protection
        2. 8.3.3.2 Schottky for Current Surge Protection
        3. 8.3.3.3 PP_EXT Power Path Control
        4. 8.3.3.4 PP_CABLE Power Switch
          1. 8.3.3.4.1 PP_CABLE Overcurrent Protection
          2. 8.3.3.4.2 PP_CABLE Input Good Monitor
        5. 8.3.3.5 VBUS Transition to VSAFE5V
        6. 8.3.3.6 VBUS Transition to VSAFE0V
      4. 8.3.4  Cable Plug and Orientation Detection
        1. 8.3.4.1 Configured as a DFP
        2. 8.3.4.2 Configured as a UFP
        3. 8.3.4.3 Configured as a DRP
        4. 8.3.4.4 Fast Role Swap Signaling
      5. 8.3.5  Dead Battery Operation
        1. 8.3.5.1 Dead Battery Advertisement
        2. 8.3.5.2 BUSPOWER (ADCIN1)
      6. 8.3.6  ADC
      7. 8.3.7  DisplayPort HPD
      8. 8.3.8  Digital Interfaces
        1. 8.3.8.1 General GPIO
        2. 8.3.8.2 I2C
        3. 8.3.8.3 SPI
      9. 8.3.9  Digital Core
      10. 8.3.10 I2C Interfaces
        1. 8.3.10.1 I2C Interface Description
        2. 8.3.10.2 I2C Clock Stretching
        3. 8.3.10.3 I2C Address Setting
        4. 8.3.10.4 Unique Address Interface
        5. 8.3.10.5 I2C Pin Address Setting (ADCIN2)
      11. 8.3.11 SPI Controller Interface
      12. 8.3.12 Thermal Shutdown
      13. 8.3.13 Oscillators
    4. 8.4 Device Functional Modes
      1. 8.4.1 Boot
      2. 8.4.2 Power States
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 USB4 Device Application with Host Charging
        1. 9.2.1.1 Design Requirements
          1. 9.2.1.1.1 Power Supply Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 USB Power Delivery Source Capabilities
          2. 9.2.1.2.2 USB Power Delivery Sink Capabilities
          3. 9.2.1.2.3 Supported Data Modes
          4. 9.2.1.2.4 USB4 Hub Controller & PD Controller I2C Communication
          5. 9.2.1.2.5 Dock Management Controller & PD Controller I2C Communication
          6. 9.2.1.2.6 SPI Flash Options
  10. 10Power Supply Recommendations
    1. 10.1 3.3-V Power
      1. 10.1.1 VIN_3V3 Input Switch
      2. 10.1.2 VBUS 3.3-V LDO
    2. 10.2 1.8-V Power
    3. 10.3 Recommended Supply Load Capacitance
  11. 11Layout
    1. 11.1  Layout Guidelines
    2. 11.2  Layout Example
    3. 11.3  Stack-up and Design Rules
    4. 11.4  Main Component Placement
    5. 11.5  Super Speed Type-C Connectors
    6. 11.6  Capacitor Placement
    7. 11.7  CC1/2 Capacitors & ADCIN1/2 Resistors
    8. 11.8  CC and SBU Protection Placement
    9. 11.9  CC Routing
    10. 11.10 DRAIN1 and DRAIN2 Pad Pours
    11. 11.11 VBUS Routing
    12. 11.12 Completed Layout
    13. 11.13 Power Dissipation
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Firmware Warranty Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11.3 Stack-up and Design Rules

An 8-layer stack-up is used and this particular stack is common with most processor chipset guides. In some systems a 10-layer stack-up is used, the same principles can be carried over from the 8-layer to a 10-layer stack-up. Figure 11-3 shows the details of each of the layers. The two outer layers have a thickness of 1.0-oz copper and the inner layers are 0.5-oz copper.

GUID-FB255689-2FDF-4B07-9291-6CFF1F6A9638-low.pngFigure 11-3 8 Layer Board Stack Up

Table 11-1 shows the recommended routing for each of these layers. For power routing the Power 1/2 planes can be stacked to allow for high currents.

Table 11-1 Recommend Routing for Layers
LayerRouting
SSTXRX1Differential: 85 Z, 90 Z, 100 Z, Single Ended: 50 Z, Power, and GPIO
High SpeedDifferential: 85 Z, 90 Z, 100 Z, Single Ended: 50 Z, and GPIO
Power 1Power and GPIO
Power 2Power and GPIO
SSTXRX2Differential: 85 Z, 90 Z, 100 Z, Single Ended: 50 Z, Power, and GPIO

The vias used in this layout example are 8mil/16mil. There are no blind and buried vias used in this layout example and for any via on pad used it is recommended to use epoxy filled vias. The figure below shows the via sizing.

GUID-62796F72-792F-4C49-A385-091ECFB84C70-low.gifFigure 11-4 Recommended Minimum Via Sizing
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