ZHCSDI0A October   2014  – March 2015 TPS706

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Shutdown
      3. 7.3.3 Reverse Current Protection
      4. 7.3.4 Internal Current Limit
      5. 7.3.5 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Capacitor Considerations
      2. 8.1.2 Dropout Voltage
      3. 8.1.3 Transient Response
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
      2. 10.1.2 Power Dissipation
    2. 10.2 Layout Examples
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 Spice 模型
      2. 11.1.2 器件命名规则
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

DBV Package
SOT-23-5
(Top View)
TPS706 po_dbv_bvs186.gif
DRV Package
WSON-6
(Top View)
TPS706 po_drv_bvs186.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
DRV DBV
EN 4 3 I Enable pin. Driving this pin high enables the device. Driving this pin low puts the device into low current shutdown. This pin can be left floating to enable the device. The maximum voltage must remain below 6.5 V.
GND 3 2 — Ground
IN 6 1 I Unregulated input to the device
NC 2, 5 4 — No internal connection
OUT 1 5 O Regulated output voltage. Connect a small 2.2-µF or greater ceramic capacitor from this pin to ground to assure stability.
Thermal pad — — The thermal pad is electrically connected to the GND node.
Connect to the GND plane for improved thermal performance.
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