ZHCSC15C December   2013  – June 2018 TPS709-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用电路
      2.      接地电流与 VIN 和温度间的关系
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Shutdown
      3. 7.3.3 Reverse Current Protection
      4. 7.3.4 Internal Current Limit
      5. 7.3.5 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Capacitor Considerations
      2. 8.1.2 Dropout Voltage
      3. 8.1.3 Transient Response
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
      2. 10.1.2 Power Dissipation
    2. 10.2 Layout Examples
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 评估模块
        2. 11.1.1.2 Spice 模型
      2. 11.1.2 器件命名规则
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBV|5
  • DRV|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.5 Electrical Characteristics

At –40°C ≤ TJ, TA ≤ 125°C, VIN = VOUT(nom) + 1 V or 2.7 V (whichever is greater), IOUT = 1 mA, VEN = 2 V, and CIN = COUT = 2.2-μF ceramic, unless otherwise noted. Typical values are at TJ = 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage range 2.7 30 V
VOUT Output voltage range 1.2 6.5 V
VOUT DC output accuracy VOUT < 3.3 V –2% 2%
VOUT ≥ 3.3 V –1% 1%
ΔVOUT Line regulation (VOUT(nom) + 1 V, 2.7 V) ≤ VIN ≤ 30 V 3 10 mV
Load regulation VIN = VOUT(nom) + 1.5 V or 3 V (whichever is greater), 100 µA ≤ IOUT ≤ 150 mA 20 50 mV
VDO Dropout voltage(1)(3) TPS70933-Q1, IOUT = 50 mA 295 650 mV
TPS70933-Q1, IOUT = 150 mA 975 1540
TPS70950-Q1, IOUT = 50 mA 245 500
TPS70950-Q1, IOUT = 150 mA 690 1200
ICL Output current limit(4) VOUT = 0.9 × VOUT(nom) 200 320 500 mA
IGND Ground pin current IOUT = 0 mA, VOUT ≤ 3.3 V 1.3 2.55 µA
IOUT = 0 mA, VOUT > 3.3 V 1.4 2.7
IOUT = 100 μA, VIN = 30 V 6.7 10
IOUT = 150 mA 350
ISHDN Shutdown current VEN ≤ 0.4 V, VIN = 2.7 V 150 nA
PSRR Power-supply rejection ratio f = 10 Hz 80 dB
f = 100 Hz 62
f = 1 kHz 52
Vn Output noise voltage BW = 10 Hz to 100 kHz, IOUT = 10 mA,
VIN = 2.7 V, VOUT = 1.2 V		 190 μVRMS
VEN(HI) Enable pin high (enabled) 0.9 V
VEN(LO) Enable pin high (disabled) 0 0.4 V
IEN Enable pin current EN = 1.0 V, VIN = 5.5 V 300 nA
IREV Reverse current
(flowing out of IN pin)		 VOUT = 3 V, VIN = VEN = 0 V 10 nA
Reverse current
(flowing into OUT pin)		 VOUT = 3 V, VIN = VEN = 0 V 100 nA
TSD Thermal shutdown temperature Shutdown, temperature increasing 158 °C
Reset, temperature decreasing 140
TJ Operating junction temperature –40 125 °C
(1) VDO is measured with VIN = 0.98 × VOUT(nom).
(2) Startup time = time from EN assertion to 0.95 × VOUT(nom) and load = 47 Ω.
(3) Dropout is only valid when VOUT ≥ 2.8 V because of the minimum input voltage limits.
(4) Measured with VIN = VOUT + 3 V for VOUT ≤ 2.5 V. Measured with VIN = VOUT + 2.5 V for VOUT > 2.5 V.
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