ZHCS814H
March 2012 – July 2021
TPS709
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Internal Current Limit
7.3.2
Dropout Voltage
7.3.3
Undervoltage Lockout (UVLO)
7.3.4
Reverse-Current Protection
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.1.1
Input and Output Capacitor
8.1.2
Transient Response
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
9
Power Supply Recommendations
9.1
Power Dissipation
10
Layout
10.1
Layout Guidelines
10.1.1
Thermal Protection
10.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
Development Support
11.1.1.1
Evaluation Modules
11.1.1.2
Spice Models
11.1.2
Device Nomenclature
11.2
Documentation Support
11.2.1
Related Documentation
11.3
支持资源
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DRV|6
MPDS216E
DBV|5
MPDS018T
散热焊盘机械数据 (封装 | 引脚)
DRV|6
QFND087M
订购信息
zhcs814h_oa
zhcs814h_pm
6.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged device model (CDM), per JEDEC specification JESD22-C101
(2)
±500
(1)
JEDEC document JEP155 states that 2-kV HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 500-V CDM allows safe manufacturing with a standard ESD control process.
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