SBVS100E June   2008  – September 2015 TPS720

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Inrush Current Limit
      3. 7.3.3 Shutdown
      4. 7.3.4 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Capacitor Requirements
      2. 8.1.2 Output Regulation With IN Pin Floating
      3. 8.1.3 Dropout Voltage
      4. 8.1.4 Transient Response
      5. 8.1.5 Minimum Load
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedures
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
    4. 10.4 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Mounting

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

DRV Package
6-Pin SON With Exposed Thermal Pad
Top View
TPS720 po_drv_bvs100.gif
1. TI recommends connecting the SON (DRV) package thermal pad to ground.
YZU Package
5-Pin DSBGA
Top View
TPS720 po_yzu_bvs100.gif

Pin Functions

PIN I/O DESCRIPTION
NAME DRV YZU
OUT 1 A3 O Output pin. A 2.2-μF ceramic capacitor is connected from this pin to ground, for stability and to provide load transients. See Input and Output Capacitor Requirements.
NC 2 — — No connection.
EN 3 C3 I Enable pin. A logic high signal on this pin turns the device on and regulates the voltage from IN to OUT. A logic low on this pin turns off the device.
BIAS 4 C1 I Bias supply pin. TI recommends bypassing this input with a ceramic capacitor to ground for better transient performance. See Input and Output Capacitor Requirements.
GND 5 B2 — Ground pin.
IN 6 A1 I Input pin. This pin can be a maximum of 4.5 V; VIN must not exceed VBIAS. Bypass this input with a ceramic capacitor to ground. See Input and Output Capacitor Requirements.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |