ZHCSAL3S December   2005  – November 2024 TPS74401

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Enable, Shutdown
      2. 6.3.2 Power-Good (VQFN Package Only)
      3. 6.3.3 Internal Current Limit
      4. 6.3.4 Thermal Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
    5. 6.5 Programming
      1. 6.5.1 Programmable Soft-Start
      2. 6.5.2 Sequencing Requirements
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input, Output, and Bias Capacitor Requirements
      2. 7.1.2 Transient Response
      3. 7.1.3 Dropout Voltage
      4. 7.1.4 Output Noise
    2. 7.2 Typical Applications
      1. 7.2.1 Setting the TPS74401
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Using an Auxiliary Bias Rail
      3. 7.2.3 Without an Auxiliary Bias
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Power Dissipation
        2. 7.4.1.2 Thermal Considerations
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
      2. 8.1.2 Device Nomenclature
    2. 8.2 Device Support
      1. 8.2.1 Development Support
        1. 8.2.1.1 Evaluation Modules
        2. 8.2.1.2 Spice Models
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9 Revision History

Changes from Revision R (April 2017) to Revision S (November 2024)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 通篇添加了旧芯片和新芯片的标注Go
  • 更改了特性 和应用 部分Go
  • 将器件信息 表更改为封装信息 Go
  • Changed Typical Characteristics section: Identified legacy chip plots and added new chip plotsGo
  • Changed Output Noise sectionGo

Changes from Revision Q (April 2015) to Revision R (April 2017)

  • 在文档中增加了 RGR 封装Go
  • 通篇将 TPS744xx 更改为 TPS74401Go
  • 更改了封装 特性要点Go
  • 更改了“说明”部分的第二段：增加了 RGR 封装，更改了第二句到最后一句Go
  • 删除了典型应用电路 图的固定电压版本Go
  • Added RGR package to Pin Configuration and Functions section Go
  • Changed FB/SNS to FB in both pin out drawings, deleted TPS744xx from VQFN package Go
  • Changed Surface Mount to Top View in KTW pin out drawingGo
  • Changed input capacitor to bias capacitor in BIAS pin description Go
  • Deleted (adjustable version only) from description of FB pin in Pin Functions table Go
  • Changed I/O column value to — from O for NC pins of Pin Functions table Go
  • Deleted SNS pin from Pin Functions table Go
  • Added RGR package to Thermal Information table Go
  • Deleted "adjustable" from footnote 1 and deleted "ISNS" from footnote 4 of Electrical Characteristics tableGo
  • Deleted (adjustable version) from VREF parameter name in Electrical Characteristics table Go
  • Deleted SNS pin reference from IFB,ISNS parameter: Changed symbol from IFB, ISNS to IFB, deleted sense from parameter nameGo
  • Changed conditions of R1, R2 in Noise Spectral Density figureGo
  • Deleted Fixed Voltage Versions figure from Functional Block Diagram sectionGo
  • Changed first paragraph of Application Information section: deleted and tracking capabilities from first sentence and changed very low input and output voltages to very low output voltages with low VIN to VOUT headroom in last sentenceGo
  • Changed title of first typical application from Adjustable Voltage Part and Setting to Setting the TPS74401 Go
  • Deleted reference to adjustable version in first sentence and Typical Application Circuit for the TPS74401 figure in first typical application sectionGo
  • Changed Because VIN ≥ VOUT + 1.62V to Because VIN is less than VOUT plus the VBIAS dropout and VBIAS = VIN to VBIAS = VOUT in last paragraph of Detailed Design Procedure in first typical application sectionGo
  • Deleted Fixed Voltage and Sense Pin sectionGo
  • Deleted BIAS recommendation from Layout Guidelines sectionGo
  • Added RGR package to VQFN description in Power Dissipation sectionGo
  • Added RGR package to Thermal Considerations section Go
  • Changed RGW Package to VQFN Packages in caption of Layout Schematic figureGo
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