ZHCSHL0C June 2019 – May 2022 TPS745-Q1
PRODUCTION DATA
PIN | I/O | DESCRIPTION | ||||
---|---|---|---|---|---|---|
NAME | DRV (Fixed) | DRV (Adjust) | DRB (Fixed) | DRB (Adjust) | ||
EN | 4 | 4 | 5 | 5 | Input | Enable pin. Drive EN greater than VEN(HI) to turn on the regulator. Drive EN less than VEN(LO) to put the low-dropout regulator (LDO) into shutdown mode. |
FB | — | 2 | — | 3 | — | This pin is used as an input to the control loop error amplifier and is used to set the output voltage of the LDO. |
GND | 3 | 3 | 4 | 4 | — | Ground pin. |
IN | 6 | 6 | 8 | 8 | Input | Input pin. For best transient response and to minimize input impedance, use the recommended value or larger ceramic capacitor from IN to ground as listed in the Section 6.3 table and the Section 8.1.2 section. Place the input capacitor as close to the output of the device as possible. |
NC | 2 | — | 2, 3, 7 | 2, 7 | — | No internal connection. Ground this pin for better thermal performance. |
OUT | 1 | 1 | 1 | 1 | Output | Regulated output voltage pin. A capacitor is required from OUT to ground for stability. For best transient response, use the nominal recommended value or larger ceramic capacitor from OUT to ground; see the Section 6.3 table and the Section 8.1.2 section. Place the output capacitor as close to output of the device as possible. |
PG | 5 | 5 | 6 | 6 | Output | Power-good output. Available in open-drain and push-pull topologies. A pullup resistor is only required for the open-drain type. For the open-drain version, if the power-good functionality is not being used, ground this pin or leave floating. For the push-pull version, if the power-good functionality is not being used, leave this pin floating. |
Thermal Pad | — | The thermal pad is electrically connected to the GND node. Connect to the GND plane for improved thermal performance. |