ZHCSN52D April   2010  – December 2023 TPS74701-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics: IOUT = 50 mA
    7. 5.7 Typical Characteristics: VEN = VIN = 1.8 V, VOUT = 1.5 V
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Transient Response
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Output Noise
      4. 6.3.4 Enable and Shutdown
      5. 6.3.5 Power Good
      6. 6.3.6 Internal Current Limit
      7. 6.3.7 Thermal Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input, Output, and Bias Capacitor Requirements
        2. 7.2.2.2 Programmable Soft-Start
        3. 7.2.2.3 Sequencing Requirements
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Layout Recommendations and Power Dissipation
        2. 7.4.1.2 Estimating Junction Temperature
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device Nomenclature
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.1.2 Device Nomenclature

Table 8-1 Device Nomenclature
PRODUCT(1) DESCRIPTION
TPS74701QyyyzM3Q1 Q indicates that this device is a grade-1 device in accordance with the AEC-Q100 standard.
yyy is the package designator.
z is the package quantity.
M3 is a suffix designator for devices that only use the latest manufacturing flow (CSO: RFB). Devices without this suffix can ship with the legacy chip (CSO: DLN) or the new chip (CSO: RFB). The reel packaging label provides CSO information to distinguish which chip is used. Device performance for new and legacy chips is denoted throughout the document.
Q1 indicates that this device is an automotive grade (AEC-Q100) device.
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the device product folder on www.ti.com.
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