ZHCSN51K June   2007  – June 2024 TPS74901

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics: IOUT = 50mA
    7. 5.7 Typical Characteristics: IOUT = 1 A
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Enable and Shutdown
      2. 6.3.2 Power-Good
      3. 6.3.3 Internal Current Limit
      4. 6.3.4 Thermal Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input, Output, and BIAS Capacitor Requirements
      2. 7.1.2 Transient Response
      3. 7.1.3 Dropout Voltage
      4. 7.1.4 Output Noise
      5. 7.1.5 Programmable Soft-Start
      6. 7.1.6 Sequencing Requirements
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Power Dissipation
        2. 7.4.1.2 Thermal Considerations
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
      2. 8.1.2 Development Support
        1. 8.1.2.1 Evaluation Modules
        2. 8.1.2.2 Spice Models
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9 Revision History

Changes from Revision J (April 2023) to Revision K (June 2024)

  • 将 M3 引用更改为新芯片 在说明 部分中添加了整个线路、负载和温度范围内的精度：1%（新芯片） Go
  • Added (Legacy Chip) to KTW packageGo
  • Changed Typical Characteristics: IOUT = 50mA section and added new chip curvesGo
  • Changed Typical Characteristics: IOUT = 1 A section, added new chip curves side by side to legacy curvesGo
  • Changed Legacy Chip Functional Block Diagram to include pulldown resistor for legacy chip and added New Chip Functional Block Diagram Go
  • Added active pulldown circuit discussion and equation to Enable and Shutdown sectionGo
  • Added SOFT-START TIME (New Chip) column and changed footnote in Standard Capacitor Values for Programming the Soft-Start Time tableGo
  • Added feed-forward capacitor discussion to Programmable Soft-Start sectionGo
  • Changed Application Curves section to only show new chip curvesGo
  • Changed last sentence of Layout Recommendations and Power Dissipation section; added Figure 7-7 Go
  • Deleted (previously numbered) Figure 35 through Figure 39Go
  • Added Device Nomenclature sectionGo

Changes from Revision I (May 2016) to Revision J (April 2023)

  • 更新了整个文档中的表格、图和交叉参考的编号格式 Go
  • 向文档添加了 M3 后缀器件Go
  • 添加了指向应用 部分的链接Go
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