SLVS208J May 1999 – August 2015 TPS767
PRODUCTION DATA.
- 1 Features
- 2 Description
- 3 Revision History
- 4 Description (Continued)
- 5 Device Options
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Parameter Measurement Information
- 9 Detailed Description
- 10Application and Implementation
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
- D|8
- PWP|20
散热焊盘机械数据 (封装 | 引脚)
- PWP|20
订购信息
11 Layout
11.1 Power Dissipation and Junction Temperature
Specified regulator operation is assured to a junction temperature of 125°C; the maximum junction temperature should be restricted to 125°C under normal operating conditions. This restriction limits the power dissipation the regulator can handle in any given application. To ensure the junction temperature is within acceptable limits, calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD, which must be less than or equal to PD(max).
The maximum-power-dissipation limit is determined using the following equation:
Where:
TJmax is the maximum allowable junction temperature.
RθJA is the thermal resistance junction-to-ambient for the package, i.e., 172°C/W for the 8-terminal SOIC and
RθJA 32.6°C/W for the 20-terminal PWP with no airflow.
TA is the ambient temperature.
The regulator dissipation is calculated using:
Power dissipation resulting from quiescent current is negligible. Excessive power dissipation will trigger the thermal protection circuit.