SBVS115D August   2008  – January 2015 TPS782

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Active VOUT Pulldown
      3. 7.3.3 Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Dropout Voltage
        3. 8.2.2.3 Transient Response
        4. 8.2.2.4 Minimum Load
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don’ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Protection
    4. 10.4 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from C Revision (January 2014) to D Revision

  • Added ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed document format to latest data sheet standards; moved existing sectionsGo
  • Changed factory programming feature bullet Go
  • Added input voltage range feature bullet Go
  • Changed Applications list Go
  • Changed Description section text (all paragraphs)Go
  • Added simplified schematic to front page Go
  • Deleted footnotes from pin configuration drawings Go
  • Changed pin descriptions throughout Pin Functions table Go
  • Changed operating junction temperature range maximum value in Absolute Maximum Ratings tableGo
  • Deleted Dissipation Ratings table; see Thermal Information tableGo
  • Changed symbol and parameter names for clarity in Electrical Characteristics table Go

Changes from B Revision (May 2010) to C Revision

  • Changed IQ value in Description section from 1 µA to 500 nA Go

Changes from A Revision (September 2008) to B Revision

  • Changed first bullet of Features listGo
  • Updated title of data sheetGo
  • Changed ground pin current, IOUT = 0mA typical specification from 1.0 μA to 0.42 μAGo
  • Added Figure 6Go
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