ZHCSKU3C February 2020 – January 2022 TPS784-Q1
PRODUCTION DATA
PIN | I/O | DESCRIPTION | ||||||
---|---|---|---|---|---|---|---|---|
NAME | DBV (Adjustable) | DBV (Fixed) | DRB (Adjustable) | DRB (Fixed) | DRB (Adjustable) B Version | DRB (Fixed) B Version | ||
EN | 3 | 3 | 7 | 7 | 6 | 6 | Input | Enable pin. Driving this pin to logic high enables the device; driving this pin to logic low disables the device. Do not float this pin. If not used, connect EN to IN. |
FB | 4 | — | 2 | — | 2 | — | Input | Feedback pin. Input to the control-loop error amplifier. This pin is used to set the output voltage of the device with the use of external resistors. Do not float this pin. For adjustable-voltage version devices only. |
GND | 2 | 2 | 5 | 5 | 5 | 5 | — | Ground pin. This pin must be connected to ground on the board. |
IN | 1 | 1 | 8 | 8 | 8 | 8 | Input | Input pin. For best transient response and to minimize input impedance, use the recommended value or larger ceramic capacitor from IN to ground; see the Recommended Operating Conditions table. Place the input capacitor as close to the input of the device as possible. |
NC | — | 4 | 3, 4, 6 | 2, 3, 4, 6 | 3, 4, 7 | 2, 3, 4, 7 | — | No connect pin. This pin is not internally connected. Connect to ground for best thermal performance or leave floating. |
OUT | 5 | 5 | 1 | 1 | 1 | 1 | Output | A 0.47-µF or greater effective capacitance is required from OUT to ground for stability. For best transient response, use a 1-µF or larger ceramic capacitor from OUT to ground. Place the output capacitor as close to output of the device as possible; see the Recommended Operating Conditions table. |
Thermal Pad | N/A | N/A | Pad | Pad | Pad | Pad | — | The thermal pad is electrically connected to the GND pin. Connect the thermal pad to a large-area GND plane for improved thermal performance. |