ZHCSN73B January   2021  – January 2022 TPS785-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Foldback Current Limit
      2. 7.3.2 Output Enable
      3. 7.3.3 Active Discharge
      4. 7.3.4 Undervoltage Lockout (UVLO) Operation
      5. 7.3.5 Dropout Voltage
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Adjustable Device Feedback Resistors
      4. 8.1.4 Load Transient Response
      5. 8.1.5 Exiting Dropout
      6. 8.1.6 Dropout Voltage
      7. 8.1.7 Reverse Current
      8. 8.1.8 Feed-Forward Capacitor (CFF)
      9. 8.1.9 Power Dissipation (PD)
        1. 8.1.9.1 Estimating Junction Temperature
        2. 8.1.9.2 Recommended Area for Continuous Operation
        3. 8.1.9.3 Power Dissipation versus Ambient Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Additional Layout Considerations
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
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订购信息

6.5 Electrical Characteristics

at operating temperature range (TJ = –40°C to +150°C), VIN = VOUT(nom) + 0.75 V or 2.0  V (whichever is greater), IOUT =
1 mA, VEN = VIN, and CIN = COUT = 1 µF, unless otherwise noted. All typical values at TJ = 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage 1.7 6.0 V
VOUT Output voltage Adjustable output 1.2 5.5 V
Fixed output 0.65 5.0
VOUT Output accuracy(5) (1) 1 mA ≤ IOUT ≤ 1 A,
VOUT(nom) + 0.75 V or 2.0 V (whichever is greater) ≤ VIN ≤ 6.0 V 		 TJ = 25°C –0.5 0.5 %
–40°C ≤ TJ  ≤ 85°C –1 1
–40°C ≤ TJ  ≤ 150°C –1.7 1.7
VOUT Line regulation VOUT(nom) + 0.75 V or 2.0  V (whichever is greater) ≤ VIN ≤ 6.0 V 0.3 mV
VOUT Load regulation 0.1 mA ≤ IOUT ≤ 1 A –40°C ≤ TJ  ≤ 85°C –7.5 7.5 mV
0.1 mA ≤ IOUT ≤ 1 A,
–40°C ≤ TJ  ≤ 150°C		 VOUT ≤ 3.3 V –7.5 15
VOUT > 3.3 V –7.5 20
ΔVOUT Load transient response settling time(2) (3) tR = tF = 1 µs, COUT = 10 µF IOUT = 300 mA to
700 mA		 10 µs
Load transient response overshoot, undershoot (3) (6) IOUT = 300 mA to
700 mA		 –2% %VOUT
IOUT = 700 mA to
300 mA		 10% %VOUT
IOUT = 0 mA to
1000 mA		 –10% %VOUT
IGND Ground current IOUT = 0 mA
VOUT(nom) + 0.5 V or 2.0 V (whichever is greater) ≤ VIN ≤ 6.0 V		 TJ = 25°C 15 25 33 µA
–40°C ≤ TJ  ≤ 85°C 35 µA
–40°C ≤ TJ  ≤ 150°C 40 µA
IOUT = 500 µA
VOUT(nom) + 0.5 V or 2.0 V (whichever is greater) ≤ VIN ≤ 6.0 V		 TJ = 25°C 33 44 µA
–40°C ≤ TJ  ≤ 85°C 47 µA
–40°C ≤ TJ  ≤ 150°C 50 µA
IOUT = 100 µA
VOUT(nom) + 0.5 V or 2.0 V (whichever is greater) ≤ VIN ≤ 6.0 V		 –40°C ≤ TJ  ≤ 85°C 45 µA
ISHDN Shutdown current VEN ≤ 0.3 V
VOUT(nom) + 0.5 V or 2.0 V (whichever is greater) ≤ VIN ≤ 6.0 V		 TJ = 25°C 0.01 0.05 µA
–40°C ≤ TJ  ≤ 85°C 0.25
–40°C ≤ TJ  ≤ 150°C 3
VFB Feedback voltage Adjustable output only 1.182 1.2 1.218 V
IFB Feedback pin current Adjustable output only –0.05 0.01 0.05 µA
ICL Output current limit VIN = VOUT(nom) + 1.25 V or 2.0 V (whichever is greater),
VOUT = 0.9 x VOUT(nom) (4) 		1.04 1.65 A
ISC Short-circuit current limit VOUT = 0 V 550 mA
VDO Dropout voltage (DRB package) IOUT = 1 A,
VOUT = 0.95 x VOUT(nom) 		0.65 V ≤ VOUT < 0.8 V 1130 mV
0.8 V ≤ VOUT < 1.0 V 960
1.0 V ≤ VOUT < 1.2 V 800
1.2 V ≤ VOUT < 1.5 V 725
1.5 V ≤ VOUT < 1.8 V 500
1.8 V ≤ VOUT < 2.5 V 425
2.5 V ≤ VOUT < 3.3 V 350
3.3 V ≤ VOUT ≤ 5.5 V 315
Dropout voltage (KVU package) IOUT = 1 A,
VOUT = 0.95 x VOUT(nom) 		0.65 V ≤ VOUT < 0.8 V 1225
0.8 V ≤ VOUT < 1.0 V 1070
1.0 V ≤ VOUT < 1.2 V 915
1.2 V ≤ VOUT < 1.5 V 755
1.5 V ≤ VOUT < 1.8 V 605
1.8 V ≤ VOUT < 2.5 V 540
2.5 V ≤ VOUT < 3.3 V 455
3.3 V ≤ VOUT ≤ 5.5 V 425
IOUT = 850 mA,
VOUT = 0.95 x VOUT(nom) 		VOUT = 1.8 V 500
IOUT = 500 mA,
VOUT = 0.95 x VOUT(nom) 		VOUT = 1.2 V 500
PSRR Power-supply rejection ratio IOUT =  1 A, VIN =
VOUT + 1 V		 f = 1 kHz 60 dB
f = 100 kHz 45
f = 1 MHz 30
Vn Output noise voltage BW = 10 Hz to 100 kHz, VOUT = 1.2 V 30 µVRMS
VUVLO UVLO threshold VIN rising 1.28 1.42 1.62 V
VIN falling 1.17 1.29 1.42
VUVLO(HYST) UVLO hysteresis VIN hysteresis 130 mV
tSTR Start-up time From EN low-to-high transition to VOUT = VOUT(nom) x 92% 280 550 785 µs
VEN(HI) EN pin logic high voltage 0.9 V
VEN(LOW) EN pin logic low voltage 0.3
IEN Enable pin current VIN = VEN = 6.0 V 10 nA
RPULLDOWN Pulldown resistance VIN = 3.3 V 100 Ω
TSD(shutdown) Thermal shutdown temperature Shutdown, temperature increasing 170 °C
TSD(reset) Thermal shutdown reset temperature Reset, temperature decreasing 155
(1) Resistor tolerance is not included in overall accuracy in the adjustable version.
(2) The settling time is measured from when IOUT is stepped from 300 mA to 700 mA to when the output voltage recovers to VOUT =
VOUT(nom) - 5 mV.
(3) This specification is verified by design.
(4) The output is being forced to 90% of the nominal VOUT value.
(5) Based on ambient temperature power dissipation should be limited to avoid thermal shutdown.
(6) This specification is in relation to the change from the nominal output voltage (VOUT(nom)).
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