SLVS351P September   2002  – March 2015

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Shutdown
      2. 7.3.2 Start-Up
      3. 7.3.3 Undervoltage Lockout (UVLO)
      4. 7.3.4 Regulator Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Output Noise
        3. 8.2.2.3 Dropout Voltage
        4. 8.2.2.4 Programming the TPS79601 Adjustable LDO Regulator
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout Recommendation to Improve PSRR and Noise Performance
      2. 10.1.2 Regulator Mounting
    2. 10.2 Layout Examples
    3. 10.3 Thermal Considerations
    4. 10.4 Estimating Junction Temperature
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

11.1.1.1 Evaluation Modules

An evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the TPS796. The TPS79601DRBEVM evaluation module can be requested at the TI website through the product folders or purchased directly from the TI eStore.

11.1.1.2 Spice Models

Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. A SPICE model for the TPS796 is available through the product folders under simulation models.

11.1.2 Device Nomenclature

Table 3. Device Nomenclature(1)

PRODUCT VOUT
TPS796xx(x)yyyz xx(x) is nominal output voltage (for example, 28 = 2.8 V, 285 = 2.85 V, 01 = Adjustable).
yyy is package designator.
z is package quantity.
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation, see the following:

  • Using New Thermal Metrics, SBVA025
  • IC Package Thermal Metrics, SPRA953
  • TPS79601DRBEVM User's Guide, SLVU130
  • Solder Pad Recommendations for Surface-Mount Devices, SBFA015

11.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 4. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TPS79601 Click here Click here Click here Click here Click here
TPS79613 Click here Click here Click here Click here Click here
TPS79618 Click here Click here Click here Click here Click here
TPS79625 Click here Click here Click here Click here Click here
TPS79628 Click here Click here Click here Click here Click here
TPS79630 Click here Click here Click here Click here Click here
TPS79633 Click here Click here Click here Click here Click here
TPS79650 Click here Click here Click here Click here Click here
TPS79601 Click here Click here Click here Click here Click here
TPS79613 Click here Click here Click here Click here Click here
TPS79618 Click here Click here Click here Click here Click here
TPS79625 Click here Click here Click here Click here Click here
TPS79628 Click here Click here Click here Click here Click here
TPS79630 Click here Click here Click here Click here Click here
TPS79633 Click here Click here Click here Click here Click here
TPS79650 Click here Click here Click here Click here Click here

11.4 Trademarks

Bluetooth is a registered trademark of Bluetooth SIG, Inc.

PowerPAD is a trademark of Texas Instruments Inc.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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