ZHCSOY3L January 2005 – February 2022 TPS799
PRODUCTION DATA
THERMAL METRIC(1) | TPS799 | UNIT | |||
---|---|---|---|---|---|
DDC
(SOT-23-THIN) |
DRV (WSON) |
YZU (DSBGA) |
|||
5 PINS | 6 PINS | 5 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 225.3 | 74.2 | 143.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 39.3 | 58.8 | 1.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 47.3 | 145.9 | 84.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.5 | 0.2 | 3.8 | °C/W |
ψJB | Junction-to-board characterization parameter | 46.7 | 54.4 | 84.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 7.2 | N/A | °C/W |