ZHCSOY3L January   2005  – February 2022 TPS799

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 描述
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Shutdown
      3. 7.3.3 Start Up
      4. 7.3.4 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Output Noise
        3. 8.2.2.3 Dropout Voltage
        4. 8.2.2.4 Transient Response
        5. 8.2.2.5 Minimum Load
        6. 8.2.2.6 Feedback Capacitor Requirements (TPS79901 Only)
      3. 8.2.3 Application Curve
    3. 8.3 What To Do and What Not To Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
      2. 10.1.2 Thermal Information
        1. 10.1.2.1 Thermal Protection
        2. 10.1.2.2 Power Dissipation
        3. 10.1.2.3 Package Mounting
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision K (January 2015) to Revision L (September 2021)

  • 在特性 要点中添加了 10kHz 时的 PSRR 值Go
  • 在特性 要点中添加了缺失的封装Go
  • 通篇将 SOT 更改为 SOT-23-THIN，将 SON 更改为 WSON Go
  • 更改了应用 要点Go
  • 更改了器件信息 表中的 DSBGA 封装尺寸值Go
  • Changed YZY package to YZU in Pin Functions table (typo)Go
  • Added note (1) to Recommended Operating Conditions; moved from Electrical Characteristics Go
  • Deleted Input Voltage from Electrical Characteristics; already shown in Recommended Operating Conditions Go
  • Deleted Junction Temperature from Electrical Characteristics; already shown in Recommended Operating Conditions Go
  • Changed Do's and Don'ts title to What To Do and What Not To Do Go

Changes from Revision J (August 2010) to Revision K (January 2015)

  • 添加了 ESD 等级 表、特性说明 部分、器件功能模式、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go
  • 更改了特性列表Go
  • 更改了说明 部分Go
  • 更改了首页图形；用应用电路替换了器件引脚排列Go
  • Changed Pin Configuration and Functions section; updated table format, renamed pin packagesGo
  • Changed "free-air" to "junction" temperature in condition statement for Absolute Maximum Ratings Go
  • Changed free-air to junction in Recommended Operating Conditions table conditionsGo
  • Added thermal information for additional device packages Go
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