4 修订历史记录
Changes from C Revision (April 2019) to D Revision
- Changed 将 DBZ 封装从 APL 更改为生产数据Go
- Added DBZ package to Load Regulation parameter in Electrical Characteristics table Go
- Added DBZ package to Dropout voltage parameter in Electrical Characteristics tableGo
- Added condition statement to IQ vs VIN and Temperature figure Go
Changes from B Revision (August 2018) to C Revision
- Added 向文档添加了 DBZ 封装(作为 APL 发行版)Go
Changes from A Revision (May 2018) to B Revision
- Changed 在文档标题中将 1mm × 1mm 更改成了小型Go
- Changed 将 YKA (DSBGA) 封装状态更改成了“生产数据”Go
- Added Accuracy for 1.825 V in Electrical Characteristics tableGo
- Changed Output current limit in Electrical Characteristics tableGo
- Added Output current limit for +85°C in Electrical Characteristics tableGo
- Changed Short-circuit current limit in Electrical Characteristics tableGo
- Added Dropout voltage for 1.825 V in Electrical Characteristics tableGo
- Changed y-axis scaling and added conditions for IOUT Transient 0 mA to 100 mA figureGo
- Changed y-axis scaling and added conditions for IOUT Transient 0 mA to 200 mA figure Go
- Added IOUT Transient 0 mA to 50 mA figure to IOUT Transient 3 µA to 3 mA figureGo
- Added slew rate condition to VIN Transient figures (IOUT = 100 mA and IOUT = 200 mA)Go
- Added VIN Transient figures (IOUT = 150 mA and IOUT = 20 mA)Go
- Added VIN condition to PSRR vs Frequency and IOUT figure (VOUT = 1.8 V)Go
Changes from * Revision (February 2018) to A Revision