ZHCSHN3D February   2018  – August 2019 TPS7A05

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      典型应用电路
      2.      接地电流与输出电流间的关系
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Excellent Transient Response
      2. 7.3.2 Active Discharge
      3. 7.3.3 Low IQ in Dropout
      4. 7.3.4 Undervoltage Lockout (UVLO)
      5. 7.3.5 Enable
      6. 7.3.6 Internal Foldback Current Limit
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Dropout Mode
      3. 7.4.3 Disable Mode
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Special Considerations When Ramping Down VIN and Enable
      4. 8.1.4 Load Transient Response
      5. 8.1.5 Dropout Voltage
        1. 8.1.5.1 Behavior When Transitioning From Dropout Into Regulation
        2. 8.1.5.2 Behavior of Output Resulting From Line Transient When in Dropout
      6. 8.1.6 Undervoltage Lockout (UVLO) Operation
      7. 8.1.7 Power Dissipation (PD)
        1. 8.1.7.1 Estimating Junction Temperature
        2. 8.1.7.2 Recommended Area for Continuous Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Design Considerations
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Spice 模型
      2. 11.1.2 器件命名规则
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

修订历史记录

Changes from C Revision (April 2019) to D Revision

  • Changed 将 DBZ 封装从 APL 更改为生产数据Go
  • Added DBZ package to Load Regulation parameter in Electrical Characteristics table Go
  • Added DBZ package to Dropout voltage parameter in Electrical Characteristics tableGo
  • Added condition statement to IQ vs VIN and Temperature figure Go

Changes from B Revision (August 2018) to C Revision

  • Added 向文档添加了 DBZ 封装(作为 APL 发行版)Go

Changes from A Revision (May 2018) to B Revision

  • Changed 在文档标题中将 1mm × 1mm 更改成了小型Go
  • Changed 将 YKA (DSBGA) 封装状态更改成了“生产数据”Go
  • Added Accuracy for 1.825 V in Electrical Characteristics tableGo
  • Changed Output current limit in Electrical Characteristics tableGo
  • Added Output current limit for +85°C in Electrical Characteristics tableGo
  • Changed Short-circuit current limit in Electrical Characteristics tableGo
  • Added Dropout voltage for 1.825 V in Electrical Characteristics tableGo
  • Changed y-axis scaling and added conditions for IOUT Transient 0 mA to 100 mA figureGo
  • Changed y-axis scaling and added conditions for IOUT Transient 0 mA to 200 mA figure Go
  • Added IOUT Transient 0 mA to 50 mA figure to IOUT Transient 3 µA to 3 mA figureGo
  • Added slew rate condition to VIN Transient figures (IOUT = 100 mA and IOUT = 200 mA)Go
  • Added VIN Transient figures (IOUT = 150 mA and IOUT = 20 mA)Go
  • Added VIN condition to PSRR vs Frequency and IOUT figure (VOUT = 1.8 V)Go

Changes from * Revision (February 2018) to A Revision

  • 已发布至生产Go