ZHCS237F December   2011  – October 2015 TPS7A16

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Regulated Output (VOUT)
      3. 7.3.3 Power-Good
      4. 7.3.4 PG Delay Timer (DELAY)
      5. 7.3.5 Internal Current Limit
      6. 7.3.6 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 TPS7A1601 Circuit as an Adjustable Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Adjustable Voltage Operation
            1. 8.2.1.2.1.1 Resistor Selection
            2. 8.2.1.2.1.2 Capacitor Recommendations
            3. 8.2.1.2.1.3 Input and Output Capacitor Requirements
            4. 8.2.1.2.1.4 Feed-Forward Capacitor
            5. 8.2.1.2.1.5 Transient Response
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Automotive Applications
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Device Recommendations
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Multicell Battery Packs
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
      4. 8.2.4 Battery-Operated Power Tools
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
        3. 8.2.4.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Additional Layout Considerations
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
    4. 10.4 Thermal Considerations
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档　
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

DGN Package
8-Pin HVSSOP
Top View
TPS7A16 po_dgn_bvs171.gif
DRB Package
8-Pin VSON
Top View
TPS7A16 po_drb_bvs171.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
DELAY 7 O Delay pin. Connect a capacitor to GND to adjust the PG delay time; leave open if the reset function is not needed.
EN 5 I Enable pin. This pin turns the regulator on or off.
If VEN ≥ VEN_HI, the regulator is enabled.
If VEN ≤ VEN_LO, the regulator is disabled.
If not used, the EN pin can be connected to IN. Make sure that VEN ≤ VIN at all times.
FB/DNC 2 I For the adjustable version (TPS7A1601), the feedback pin is the input to the control-loop error amplifier. This pin is used to set the output voltage of the device when the regulator output voltage is set by external resistors.
For the fixed voltage versions: Do not connect to this pin. Do not route this pin to any electrical net, not even GND or IN.
GND 4 GND Ground pin.
IN 8 IN Regulator input supply pin. A capacitor ≥ 0.1 µF must be tied from this pin to ground to assure stability. TI recommends connecting a 10-µF ceramic capacitor from IN to GND (as close to the device as possible) to reduce circuit sensitivity to printed-circuit-board (PCB) layout, especially when long input traces or high source impedances are encountered.
NC 6 — This pin can be left open or tied to any voltage between GND and IN.
OUT 1 O Regulator output pin. A capacitor ≥ 2.2 µF must be tied from this pin to ground to assure stability. TI recommends connecting a 10-µF ceramic capacitor from OUT to GND (as close to the device as possible) to maximize AC performance.
PG 3 O Power-good pin. Open collector output; leave open or connect to GND if the power-good function is not needed.
PowerPAD — — Solder to printed-circuit-board (PCB) to enhance thermal performance. Although it can be left floating, TI highly recommends connecting the PowerPAD to the GND plane.
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