ZHCSK49E August   2019  – September 2022 TPS7A24

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Output Enable
      2. 7.3.2 Dropout Voltage
      3. 7.3.3 Current Limit
      4. 7.3.4 Undervoltage Lockout (UVLO)
      5. 7.3.5 Thermal Shutdown
      6. 7.3.6 Active Overshoot Pulldown Circuitry
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Device Feedback Resistors
      2. 8.1.2 Recommended Capacitor Types
      3. 8.1.3 Input and Output Capacitor Requirements
      4. 8.1.4 Reverse Current
      5. 8.1.5 Feed-Forward Capacitor (CFF)
      6. 8.1.6 Power Dissipation (PD)
      7. 8.1.7 Estimating Junction Temperature
      8. 8.1.8 Special Consideration for Line Transients
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Transient Response
        2. 8.2.2.2 Selecting Feedback Divider Resistors
        3. 8.2.2.3 Thermal Dissipation
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  9. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information

THERMAL METRIC(1) TPS7A24 UNIT
DBV (SOT23-5)
5 PINS
RθJA Junction-to-ambient thermal resistance 167.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 86.7 °C/W
RθJB Junction-to-board thermal resistance 38.4 °C/W
ψJT Junction-to-top characterization parameter 14.5 °C/W
ψJB Junction-to-board characterization parameter 38.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application reports application report.