ZHCSJ50C December   2018  – December 2022 TPS7A25

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  7. 7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Output Enable
      2. 8.3.2 Dropout Voltage
      3. 8.3.3 Current Limit
      4. 8.3.4 Undervoltage Lockout (UVLO)
      5. 8.3.5 Thermal Shutdown
      6. 8.3.6 Power Good
      7. 8.3.7 Active Overshoot Pulldown Circuitry
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Functional Mode Comparison
      2. 8.4.2 Normal Operation
      3. 8.4.3 Dropout Operation
      4. 8.4.4 Disabled
        1.       Application and Implementation
          1. 9.1 Application Information
            1. 9.1.1 Adjustable Device Feedback Resistors
            2. 9.1.2 Recommended Capacitor Types
            3. 9.1.3 Input and Output Capacitor Requirements
            4. 9.1.4 Reverse Current
            5. 9.1.5 Feed-Forward Capacitor (CFF)
            6. 9.1.6 Power Dissipation (PD)
            7. 9.1.7 Estimating Junction Temperature
            8. 9.1.8 Special Consideration for Line Transients
          2. 9.2 Typical Application
            1. 9.2.1 Design Requirements
            2. 9.2.2 Detailed Design Procedure
              1. 9.2.2.1 Transient Response
              2. 9.2.2.2 Selecting Feedback Divider Resistors
              3. 9.2.2.3 Thermal Dissipation
            3. 9.2.3 Application Curve
          3. 9.3 Power Supply Recommendations
          4. 9.4 Layout
            1. 9.4.1 Layout Guidelines
            2. 9.4.2 Layout Examples
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 术语表
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DRV|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.2.2.3 Thermal Dissipation

Junction temperature can be determined using the junction-to-ambient thermal resistance (RθJA) and the total power dissipation (PD). Use Equation 13 to calculate the power dissipation. Multiply PD by RθJA and add the ambient temperature (TA), as Equation 14 shows, to calculate the junction temperature (TJ).

Equation 13. PD = (IGND+ IOUT) × (VIN – VOUT)
Equation 14. TJ = RθJA × PD + TA

Equation 15 calculates the maximum ambient temperature. Equation 16 calculates the maximum ambient temperature for this application.

Equation 15. TA(MAX) = TJ(MAX) – (RθJA × PD)
Equation 16. TA(MAX) = 125°C – [73.3°C/W × (8.4 V – 5 V) × 0.22 A] = 70.2°C
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