ZHCSHP4B December   2018  – October 2019 TPS7A26

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用电路
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Enable
      2. 7.3.2 Dropout Voltage
      3. 7.3.3 Current Limit
      4. 7.3.4 Undervoltage Lockout (UVLO)
      5. 7.3.5 Thermal Shutdown
      6. 7.3.6 Power Good
      7. 7.3.7 Active Overshoot Pulldown Circuitry
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Device Feedback Resistors
      2. 8.1.2 Recommended Capacitor Types
      3. 8.1.3 Input and Output Capacitor Requirements
      4. 8.1.4 Reverse Current
      5. 8.1.5 Feed-Forward Capacitor (CFF)
      6. 8.1.6 Power Dissipation (PD)
      7. 8.1.7 Estimating Junction Temperature
      8. 8.1.8 Special Consideration for Line Transient
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Transient Response
        2. 8.2.2.2 Selecting Feedback Divider Resistors
        3. 8.2.2.3 Thermal Dissipation
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 器件命名规则
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DRV|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

TPS7A26: DRV Package (Adjustable)
6-Pin WSON
Top View
TPS7A26: DRV Package (Fixed)
6-Pin WSON
Top View

Pin Functions

PIN I/O DESCRIPTION
NAME DRV
(Adjustable)		 DRV
(Fixed)
EN 4 4 Input Enable pin. Drive EN greater than VEN(HI) to enable the regulator. Drive EN less than VEN(LOW) to put the regulator into low-current shutdown. Do not float this pin. If not used, connect EN to IN.
FB 2 — Input Feedback pin. Input to the control-loop error amplifier. This pin is used to set the output voltage of the device with the use of external resistors. For adjustable-voltage version devices only.
GND 5 5 — Ground pin.
IN 6 6 Input Input pin. For best transient response and to minimize input impedance, use the recommended value or larger capacitor from IN to ground as listed in the Recommended Operating Conditions table. Place the input capacitor as close to the IN and GND pins of the device as possible.
NC — 2 — No internal connection. For fixed-voltage version devices only. Ths pin can be floated but the device has better thermal performance with this pin tied to GND.
OUT 1 1 Output Output pin. A capacitor is required from OUT to ground for stability. For best transient response, use the nominal recommended value or larger capacitor from OUT to ground. Follow the recommended capacitor value as listed in the Recommended Operating Conditions table. Place the output capacitor as close to the OUT and GND pins of the device as possible.
PG 3 3 Output Power-good pin; open-collector output. Pullup this pin externally to the OUT pin or another voltage rail. The PG pin goes high when VOUT > VIT(PG,RISING), as discussed in the Electrical Characteristics table. The PG pin is driven low when VOUT < VIT(PG,FALLING), as discussed in the Electrical Characteristics table. Ths pin can be floated but the device has better thermal performance with this pin tied to GND.
Thermal pad Pad Pad — Exposed pad of the package. Connect this pad to ground or leave floating. Connect the thermal pad to a large-area ground plane for best thermal performance.
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