EN |
1 |
13 |
I |
This pin turns the regulator on or off. If VEN ≥ VEN(+HI) or VEN ≤ VEN(–HI), the regulator is enabled. If VEN(+LO) ≥ VEN ≥ VEN(–LO), the regulator is disabled. The EN pin can be connected to IN, if not used. |VEN| ≤ |VIN|. |
FB |
7 |
3 |
I |
This pin is the input to the control-loop error amplifier. It is used to set the output voltage of the device. TI recommends connecting a 10-nF capacitor from FB to OUT (as close to the device as possible) to maximize AC performance. |
GND |
4 |
7 |
— |
Ground |
IN |
3 |
15, 16 |
I |
Input supply. A capacitor greater than or equal to 10 nF must be tied from this pin to ground to assure stability. It is recommended to connect a 10-µF capacitor from IN to GND (as close to the device as possible) to reduce circuit sensitivity to printed-circuit-board (PCB) layout, especially when long input traces or high source impedances are encountered. |
NC |
5 |
2, 4-6, 8-12, 17-19 |
— |
This pin can be left open or tied to any voltage between GND and IN. |
NR/SS |
2 |
14 |
— |
Noise reduction pin. A capacitor connected from this pin to GND controls the soft-start function and allows RMS noise to be reduced to very low levels. TI recommends connecting a 1-µF capacitor from NR/SS to GND (as close to the device as possible) to filter the noise generated by the internal bandgap and maximize ac performance. |
OUT |
6 |
1, 20 |
O |
Regulator output. A capacitor greater than or equal to 10 µF must be tied from this pin to ground to assure stability. TI recommends connecting a 47-µF ceramic capacitor from OUT to GND (as close to the device as possible) to maximize ac performance. |
Thermal Pad |
Tab |
— |
— |
Connect the thermal pad to a large-area ground plane. The thermal pad is internally connected to GND. An external heatsink can be installed to provide additional thermal performance. |